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Advanced Electronics Packaging Digest

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Creative Electron Launches TruView Prime SDX, Bringing Planar CT to the Benchtop

06/18/2026 | Creative Electron
Creative Electron, a U.S.-based developer of X-ray and computed tomography (CT) inspection systems, announced the launch of the TruView™ Prime SDX, a compact benchtop X-ray system designed to bring advanced inspection capabilities to a wider range of electronics manufacturing environments.

Teledyne FLIR Defense Unveils Three Vehicle Vision Systems for Enhanced Battlefield Awareness

06/16/2026 | BUSINESS WIRE
Teledyne FLIR Defense, part of Teledyne Technologies Incorporated, announced at Eurosatory the launch of three upgraded vision systems for military vehicles that enhance targeting, improve driver vision, and expand field-of-view up to 360 degrees.

Pembroke Instruments Launches Thermal Imaging Microscope for Semiconductor Failure Analysis

06/09/2026 | Pembroke Instruments, LLC
Pembroke Instruments, LLC announced the availability of its integrated Thermal Imaging Microscope platform designed for electronics testing, semiconductor failure analysis, PCB inspection, solar cell evaluation, battery analysis, and advanced materials research.

Teledyne Space Imaging Sensors Launch Aboard European Space Agency’s SMILE Mission

05/20/2026 | BUSINESS WIRE
Teledyne Space Imaging, a leading supplier of space-qualified imaging sensors, focal plane arrays and integrated camera systems, announced it supplied two CCD370 imaging sensors for the Soft X-ray Imager on the European Space Agency’s SMILE mission (Solar wind Magnetosphere Ionosphere Link Explorer).

Gregoire Outters Promoted to President of Teledyne Marine Group

04/06/2026 | Teledyne
Teledyne Technologies Incorporated announced the promotion of Gregoire Outters to President of its Teledyne Marine Group.
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