-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
LiloTree’s Dr. Kunal Shah to Present at SMTA International 2018
September 25, 2018 | LilotreeEstimated reading time: 1 minute
LiloTree’s President and Founder Dr. Kunal Shah will present a white paper called “A Novel & Cost-effective Electroless Nickel Immersion Gold (ENIG) Surface Finish for Better Reliability of Electronic Assemblies" as part of a panel discussion at this year’s SMTA International to be held on October 16 from 12:00 to 1:30 p.m. (Eastern; 11-12:30 p.m. Local).
Dr. Shah will present his paper on his National Science Foundation award winning innovative new ENIG-premium, a ground-breaking, world-changing innovation that provide better ENIG performance without cyanide. Because this product is about to be introduced to the general market, everyone interested in a much better performing ENIG (no black pads & robust solder joints) while getting rid of the cyanide and saving up to 30% on gold usage should attend this panel discussion to hear Dr. Shah talk about ENIG-premium.
Long-time industry expert, Steve Williams, had called ENIG-premium the most important technological innovation in the past 20years. “After seeing the third-party test results, I am a true believer in ENIG-premium. It performs better than traditional ENIG, including allowing for a much more controlled gold plating so that there is on average a 30% savings on gold usage. And it gets rid of that nasty cyanide. This will be good for the PCB builders and ever better for the CEMs and OEMs in terms of higher reliability who are using the boards,” said Williams.
About LiloTree
LiloTree is one of this country’s most innovative companies. They provide support and solutions for product improvements and develop materials technology for improved product performance and reliability. Their team of scientists works cohesively to provide creative technologies and solutions to support and improve your company’s products. They were awarded a National Science Foundation Grant for their development of ENIG-Premium.
For more information, click here.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.