-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
LiloTree’s Dr. Kunal Shah to Present at SMTA International 2018
September 25, 2018 | LilotreeEstimated reading time: 1 minute
LiloTree’s President and Founder Dr. Kunal Shah will present a white paper called “A Novel & Cost-effective Electroless Nickel Immersion Gold (ENIG) Surface Finish for Better Reliability of Electronic Assemblies" as part of a panel discussion at this year’s SMTA International to be held on October 16 from 12:00 to 1:30 p.m. (Eastern; 11-12:30 p.m. Local).
Dr. Shah will present his paper on his National Science Foundation award winning innovative new ENIG-premium, a ground-breaking, world-changing innovation that provide better ENIG performance without cyanide. Because this product is about to be introduced to the general market, everyone interested in a much better performing ENIG (no black pads & robust solder joints) while getting rid of the cyanide and saving up to 30% on gold usage should attend this panel discussion to hear Dr. Shah talk about ENIG-premium.
Long-time industry expert, Steve Williams, had called ENIG-premium the most important technological innovation in the past 20years. “After seeing the third-party test results, I am a true believer in ENIG-premium. It performs better than traditional ENIG, including allowing for a much more controlled gold plating so that there is on average a 30% savings on gold usage. And it gets rid of that nasty cyanide. This will be good for the PCB builders and ever better for the CEMs and OEMs in terms of higher reliability who are using the boards,” said Williams.
About LiloTree
LiloTree is one of this country’s most innovative companies. They provide support and solutions for product improvements and develop materials technology for improved product performance and reliability. Their team of scientists works cohesively to provide creative technologies and solutions to support and improve your company’s products. They were awarded a National Science Foundation Grant for their development of ENIG-Premium.
For more information, click here.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.