Smart Devices Could Soon Tap Their Owners as a Battery Source
September 27, 2018 | University of SurreyEstimated reading time: 1 minute

Scientists from Surrey’s Advanced Technology Institute (ATI) detail an innovative solution for powering the next generation of electronic devices by using Triboelectric Nanogenerators (TENGs). Along with human movements, TENGs can capture energy from common energy sources such as wind, wave, and machine vibration.
A TENG is an energy harvesting device that uses the contact between two or more (hybrid, organic or inorganic) materials to produce an electric current.
Researchers from the ATI have provided a step-by-step guide on how to construct the most efficient energy harvesters. The study introduces a “TENG power transfer equation” and “TENG impedance plots”, tools which can help improve the design for power output of TENGs.
Professor Ravi Silva, Director of the ATI, said: “A world where energy is free and renewable is a cause that we are extremely passionate about here at the ATI (and the University of Surrey) – TENGs could play a major role in making this dream a reality. TENGs are ideal for powering wearables, internet of things devices and self-powered electronic applications. This research puts the ATI in a world leading position for designing optimized energy harvesters.”
Ishara Dharmasena, PhD student and lead scientist on the project, said: “I am extremely excited with this new study which redefines the way we understand energy harvesting. The new tools developed here will help researchers all over the world to exploit the true potential of triboelectric nanogenerators, and to design optimised energy harvesting units for custom applications.”
Suggested Items
Elma’s AI Optimized CompacFrame Speeds Development of Rugged GPU-focused Applications
05/05/2025 | Elma ElectronicElma Electronic has expanded its line of SOSA aligned CompacFrame development chassis to include an AI (artificial intelligence) optimized 7-slot version.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
05/01/2025 | Cadence Design SystemsCadence announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence® digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK).
Elektrobit, Metoak Forge Strategic Partnership to Establish New Benchmark for Intelligent Driving Safety Ecosystem
04/29/2025 | ElektrobitElektrobit announced a comprehensive strategic partnership with Metoak, a leading Chinese provider of intelligent driving solutions.
Congatec Showcases High-performance Embedded Building Blocks at ElectroneX 2025
04/29/2025 | congateccongatec, a leading vendor of embedded and edge computing technology, will present its latest high-performance hardware and software building blocks at ElectroneX 2025, taking place at the Melbourne Convention and Exhibition Centre from May 7-8.