-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Goepel to Hold Free Webinar on Integration of AOI into THT Process
October 2, 2018 | GOEPEL ElectronicEstimated reading time: 1 minute
Goepel electronic will be conducting a free webinar, "Individuality desired? Flexible Integration of AOI Systems into the THT Process" on Tuesday, October 23, 2018 at 10 a.m. EST.
Assessing the diversity of all components, it can be clearly noticed: THT components are still present in significant numbers despite the march toward miniaturization and increases in integration density. What measures are being taken to guarantee assembly quality in production when utilizing these components? Usually it is done through manual means or not well-tested at all. Neither is acceptable under today’s quality demands. This fact appears more problematic, as THT components are still in use in sensitive areas—especially in the field of power electronics.
Inform yourself online and free of charge in about 60 minutes, including question and answer session about typical manufacturing problems and requirements for THT inclusive production processes. Live presentation on key insights regarding the structure of an in-line AOI system for component and solder joint inspection of THT assemblies will be given.
You will learn about various integration options for the shortest quality loop and maximum effectiveness and how inspection systems can be connected to company-internal MES and traceability systems, and which challenges and opportunities exist for AOI systems with respect to labeling of assemblies and workpieces.
The following questions will be answered during the webinar:
- What possibilities for in-line integration are offered by AOI systems for THT assemblies?
- How can these systems adapt to the given production situation?
- What labeling of workpieces and assemblies is necessary for unambiguous assignment of errors and traceability?
The webinar addresses quality and production issues and will be ideally suited to managers for electric assemblies, technologists and production planners as well as CEOs and directors of electronic manufacturing companies.
About Goepel electronic
Goepel electronic is a leading provider of innovative test and inspection solutions for printed circuit board assemblies (PCBAs) and electronic devices and systems. The company is divided into four divisions: Automotive Test Solutions, Embedded JTAG Solutions, Industrial Function Test and Inspection Solutions (AOI·AXI·SPI·IVS). Besides more than 240 employees, who work in the company’s headquarters in Jena/Germany, Goepel electronic runs several support and service offices in the UK, USA, India and China. A worldwide distribution ensures the local and on-site support of Goepel electronic’s products and solutions.
To register, visit Goepel electronic’s “Individuality desired? Flexible Integration of AOI systems into the THT process” event page.
Suggested Items
AIM to Participate in SMTA Ultra High Density Interconnect Symposium
01/15/2025 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry is pleased to announce its participation in the SMTA Ultra High Density Interconnect (UHDI) Symposium, taking place on January 23, 2025 at the Peoria Sports Complex in Peoria, Arizona.
Technica Installs CBT/MLI Direct Imaging System at Summit Interconnect Santa Clara
01/14/2025 | Technica USATechnica has recently installed the 6th CBT/MLI Direct Imaging (DI) system at Summit Interconnect's Santa Clara operation, a testament to Summit's ongoing commitment to cutting-edge technology and operational excellence.
Indium to Showcase Power Electronics Products at NEPCON Japan
01/14/2025 | Indium CorporationAs one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its lineup of high-reliability products for power electronics at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.
SolderKing to Highlight Innovations in Soldering and Manufacturing Efficiency at Southern Manufacturing & Electronics 2025
01/08/2025 | SolderKing Assembly Materials Ltd,SolderKing, a leading UK manufacturer of advanced soldering materials and consumables, will be exhibiting at the Southern Manufacturing and Electronics Show from 4-6 February 2025 at the Farnborough International Exhibition Centre, Stand J90.
Altus Highlights Heller Industries Advances in Void Reduction Under 1%
01/06/2025 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, emphasises the importance of reducing voids in reflow soldering to improve manufacturing efficiency and product reliability