Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Goepel to Hold Free Webinar on Integration of AOI into THT Process
October 2, 2018 | GOEPEL ElectronicEstimated reading time: 1 minute
Goepel electronic will be conducting a free webinar, "Individuality desired? Flexible Integration of AOI Systems into the THT Process" on Tuesday, October 23, 2018 at 10 a.m. EST.
Assessing the diversity of all components, it can be clearly noticed: THT components are still present in significant numbers despite the march toward miniaturization and increases in integration density. What measures are being taken to guarantee assembly quality in production when utilizing these components? Usually it is done through manual means or not well-tested at all. Neither is acceptable under today’s quality demands. This fact appears more problematic, as THT components are still in use in sensitive areas—especially in the field of power electronics.
Inform yourself online and free of charge in about 60 minutes, including question and answer session about typical manufacturing problems and requirements for THT inclusive production processes. Live presentation on key insights regarding the structure of an in-line AOI system for component and solder joint inspection of THT assemblies will be given.
You will learn about various integration options for the shortest quality loop and maximum effectiveness and how inspection systems can be connected to company-internal MES and traceability systems, and which challenges and opportunities exist for AOI systems with respect to labeling of assemblies and workpieces.
The following questions will be answered during the webinar:
- What possibilities for in-line integration are offered by AOI systems for THT assemblies?
- How can these systems adapt to the given production situation?
- What labeling of workpieces and assemblies is necessary for unambiguous assignment of errors and traceability?
The webinar addresses quality and production issues and will be ideally suited to managers for electric assemblies, technologists and production planners as well as CEOs and directors of electronic manufacturing companies.
About Goepel electronic
Goepel electronic is a leading provider of innovative test and inspection solutions for printed circuit board assemblies (PCBAs) and electronic devices and systems. The company is divided into four divisions: Automotive Test Solutions, Embedded JTAG Solutions, Industrial Function Test and Inspection Solutions (AOI·AXI·SPI·IVS). Besides more than 240 employees, who work in the company’s headquarters in Jena/Germany, Goepel electronic runs several support and service offices in the UK, USA, India and China. A worldwide distribution ensures the local and on-site support of Goepel electronic’s products and solutions.
To register, visit Goepel electronic’s “Individuality desired? Flexible Integration of AOI systems into the THT process” event page.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.