-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Goepel to Hold Free Webinar on Integration of AOI into THT Process
October 2, 2018 | GOEPEL ElectronicEstimated reading time: 1 minute
Goepel electronic will be conducting a free webinar, "Individuality desired? Flexible Integration of AOI Systems into the THT Process" on Tuesday, October 23, 2018 at 10 a.m. EST.
Assessing the diversity of all components, it can be clearly noticed: THT components are still present in significant numbers despite the march toward miniaturization and increases in integration density. What measures are being taken to guarantee assembly quality in production when utilizing these components? Usually it is done through manual means or not well-tested at all. Neither is acceptable under today’s quality demands. This fact appears more problematic, as THT components are still in use in sensitive areas—especially in the field of power electronics.
Inform yourself online and free of charge in about 60 minutes, including question and answer session about typical manufacturing problems and requirements for THT inclusive production processes. Live presentation on key insights regarding the structure of an in-line AOI system for component and solder joint inspection of THT assemblies will be given.
You will learn about various integration options for the shortest quality loop and maximum effectiveness and how inspection systems can be connected to company-internal MES and traceability systems, and which challenges and opportunities exist for AOI systems with respect to labeling of assemblies and workpieces.
The following questions will be answered during the webinar:
- What possibilities for in-line integration are offered by AOI systems for THT assemblies?
- How can these systems adapt to the given production situation?
- What labeling of workpieces and assemblies is necessary for unambiguous assignment of errors and traceability?
The webinar addresses quality and production issues and will be ideally suited to managers for electric assemblies, technologists and production planners as well as CEOs and directors of electronic manufacturing companies.
About Goepel electronic
Goepel electronic is a leading provider of innovative test and inspection solutions for printed circuit board assemblies (PCBAs) and electronic devices and systems. The company is divided into four divisions: Automotive Test Solutions, Embedded JTAG Solutions, Industrial Function Test and Inspection Solutions (AOI·AXI·SPI·IVS). Besides more than 240 employees, who work in the company’s headquarters in Jena/Germany, Goepel electronic runs several support and service offices in the UK, USA, India and China. A worldwide distribution ensures the local and on-site support of Goepel electronic’s products and solutions.
To register, visit Goepel electronic’s “Individuality desired? Flexible Integration of AOI systems into the THT process” event page.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.