Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Alpine 4 Technologies to Establish Contract Manufacturing Facility in Arkansas
October 4, 2018 | Globe NewswireEstimated reading time: 1 minute
Alpine 4 Technologies' Alpine 4 Technology Ltd and its subsidiaries American Precision Fabricators Inc. (APF) and Quality Circuit Assembly (QCA) entered into a joint project to bring EMS assembly and contract manufacturing to Fort Smith, Arkansas.
The joint project will utilize roughly 18,000 square feet of the existing 68,000 square feet facility that American Precision Fabricators operates in, and will be initially dedicated for higher volume cable assembly work. Alpine 4 expects that this joint project will add $2.5 million in annualized sales between the two companies over the next 18 months and grow from there.
Kent Wilson, CEO, says, "Fort Smith, Arkansas with its skilled labor pool and lower entry wage base, provides an attractive opportunity for Alpine 4 and its subsidiaries to expand its U.S. based contract manufacturing services in a means that is more competitive with companies aboard. I also firmly believe that Alpine 4's strongest competitive advantage is in our highly diversified, yet synergistic business model of Drivers, Stabilizers, and Facilitators; and we believe that this project successfully exemplifies that model."
About Alpine 4 Technologies Ltd
Alpine 4 Technologies, Ltd (ALPP) is a publicly traded conglomerate that is acquiring businesses that fit into its disruptive DSF business model of Drivers, Stabilizers, and Facilitators. At Alpine 4 we understand the nature of how technology and innovation can accentuate a business. Our focus is on how the adaptation of new technologies even in brick and mortar businesses can drive innovation. We also believe that our holdings should benefit synergistically from each other and that the ability to have collaboration across varying industries can spawn new ideas and create fertile ground for competitive advantages. This unique perspective has culminated in the development of our Blockchain enabled Enterprise Business Operating System called SPECTRUMebos.
Share on:
Suggested Items
EU Defence Electronics Ecosystem Highlighted in Brussels
07/01/2025 | I-Connect007 Editorial TeamIn this interview, Alison James, senior director of Global Electronics Association—Europe (formerly IPC), discusses the European Defence & Security Summit in Brussels, June 9–13, as well as the first IPC–ASD Europe Defense Electronics Summit, June 10th, which brought together 70 leaders from across the electronics manufacturing supply chain. ASD is the Aerospace, Security and Defence Industries Association of Europe, and co-hosted both the larger and smaller events.
Europlacer Expands U.S. Reach with New Eastern Region Representative
06/30/2025 | EuroplacerEuroplacer, a global leader in flexible SMT assembly solutions for High-Mix manufacturers, is pleased to announce the appointment of Photo Chemical Systems as its new representative for the Eastern United States.
PCBA Market to Reach $147.5 Billion by 2035, Growing at a CAGR of 4.7% from 2025
06/27/2025 | PRNewswireThe Printed Circuit Board Assembly market is projected to reach $147.5 billion by 2035, up from an estimated $90.91 billion in 2025, growing at a steady CAGR of 4.7% during the forecast period.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.