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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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MacDermid Enthone to Exhibit and Present at TPCA Show 2018
October 10, 2018 | MacDermid Enthone Electronics SolutionsEstimated reading time: 2 minutes
MacDermid Enthone Electronics Solutions, a global electronics chemicals process supplier, will exhibit at the TPCA tradeshow and present a technical paper at the IMPACT 2018 Conference, co-located with TPCA in Taipei, October 24−26, 2018.
MacDermid Enthone has invested in the research of innovative manufacturing processes to meet the demanding standards of an ever shrinking circuit board. Kesheng Feng PhD, Director of Research, Metallization, will be presenting “Electroplating Processes For IC Substrates—Embedded Trace Plate, Via Fill and Through-Hole Fill“ on October 24, 14:55 – 15.10, The paper will be presented in Session S2, Room 504 and covers a broad range of topics involving the challenges presented by the advanced metallization requirements for today’s most advanced PCBs, including SL-PCB, MSAP, and traditional IC substrate designs.
MacDermid Enthone process specialists will be on hand to discuss the chemistries and materials we offer throughout the entire electronics supply chain. Among the showcased products will be the latest MacuSpec printed circuit board metallization processes, the advanced Systek metallizations for ultra high performance via filling, embedded trace plating, and bump metallizations, as well the latest final finish and lead frame based packaging innovations. Guests can also drop by to request information about MacDermid Enthone’s complete portfolio of chemical processes for MSAP. Experts from the Alpha Assembly Solutions business will also be present in our shared booth to talk about their low temperature solder alloys, the EV focused silver sintering technology, and their wide range of assembly products. These technologies are part of a suite of processing solutions that serve the electronics manufacturing supply chain at every step, from device design, through circuit board production, semiconductor metallization, component assembly, and OEM specification. Learn more at booth #K205.
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t—MacDermid Enthone is there. For more information, click here.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is a global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others. For more information, click here.
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Rachael Temple - AlltematedSuggested Items
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