The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
SEHO to Demo Modular Selective Solder System at Matelec Spain
October 10, 2018 | SEHO North America, Inc.Estimated reading time: 1 minute
SEHO Systems GmbH will highlight the SelectLine-C at Matelec, scheduled to take place November 13-16, 2018 at the Feria de Madrid in Spain. SEHO’s representative for Spain and Portugal, Propelec S.A. will demonstrate one of the basic modules of the SelectLine-C that features the highest flexibility with outstanding low space requirements in booth #2B01.
The SelectLine machine concept is consistently modular, thus ensuring clear cost benefits. Several modules with different dimensions can individually be configurated with fluxer, preheating, soldering units, cooling module, selective brush system and AOI system, and depending on the production requirements, they may be combined to create a complete manufacturing line. Even if the basic configuration should be designed for stand-alone operation, it may be expanded with additional modules at any time to be used inline.
The SelectLine-C features innovative, award-winning technical details. It allows the integration of additional processes such as selective brushing for automatic cleaning and automated optical inspection for immediate inspection of solder joints directly after the soldering process, thus ensuring clear cost benefits. Particular highlights for the soldering area are the Synchro software feature to double the production volume without major investments, and the automatic ultrasonic cleaning of solder nozzles that guarantees maximum machine availability and a nozzle service life up to several months.
Absolutely unique is the 100 percent process control that is provided by all selective soldering systems from SEHO: ranging from flux quantity monitoring, through automatic position correction and z-height correction, to continuous wave height control, automatic nozzle measurement and many more.
For further information, please visit SEHO at Matelec in booth #2B01, click here.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.