Advanced Technology Key to Strong Foundry Revenue per Wafer
October 15, 2018 | IC InsightsEstimated reading time: 1 minute

The average revenue generated from processed wafers among the four biggest pure-play foundries (TSMC, GlobalFoundries, UMC, and SMIC) is expected to be $1,138 in 2018, when expressed in 200mm-equivalent wafers, which is essentially flat from $1,136 in 2017, according to a new analysis by IC Insights. The average revenue per wafer among the Big 4 foundries peaked in 2014 at $1,149 and then slowly declined through last year, based on IC Insights’ extensive part-two analysis of the integrated circuit foundry business in the September Update to The 2018 McClean Report.
TSMC’s average revenue per wafer in 2018 is forecast to be $1,382, which is 36% higher than GlobalFoundries’ $1,014. UMC’s average revenue per wafer in 2018 is expected to be only $715, about half of the projected amount at TSMC this year. Furthermore, TSMC is the only foundry among the Big 4 that is expected to generate higher revenue per wafer (9% more) in 2018 than in 2013. In contrast, GlobalFoundries, UMC, and SMIC’s 2018 revenue per wafer averages are forecast to decline by 1%, 10%, and 16%, respectively, compared to 2013.
Although the average revenue per wafer of the Big 4 foundries is forecast to be $1,138 this year, the amount generated is highly dependent upon the minimum feature size of the IC processing technology. The typical 2Q18 revenue per wafer for some of the major technology nodes and wafer sizes produced by pure-play foundries. In 2Q18, there was more than a 16x difference between the 0.5µ 200mm revenue per wafer ($370) and the ≤20nm 300mm revenue per wafer ($6,050). Even when using revenue per square inch, the difference is dramatic ($7.41 for the 0.5µ technology versus $53.86 for the ≤20nm technology). Since TSMC gets such a large percentage of its sales from ≤45nm production, its revenue per wafer is expected to increase by a compound annual growth rate (CAGR) of 2% from 2013 through 2018 as compared to a -2% CAGR for the total revenue per wafer average of GlobalFoundries, UMC, and SMIC during this same timeperiod.
There will probably be only three foundries able to offer high-volume leading-edge production over the next five years (i.e., TSMC, Samsung, and Intel). IC Insights believes these companies are likely to be fierce competitors among themselves—especially TSMC and Samsung—and as a result, pricing will likely be under pressure through 2022.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.