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Alpha to Focus on Auto Assembly Materials at SMTA Guadalajara Expo and Tech Forum
October 18, 2018 | Alpha Assembly SolutionsEstimated reading time: 1 minute
Alpha Assembly Solutions will exhibit its innovative assembly and connecting materials for the automotive market at the 2018 SMTA Guadalajara Exhibition and Tech Forum being held November 14-15 at the Expo Guadalajara in Guadalajara, Mexico.
As the electronic content of automobiles continues to expand, Alpha is engineering materials to meet changing needs of the automotive industry. For in-cabin electronics, Alpha will promote its low-temperature solder pastes, such ALPHA OM-550, and its high-performance fluxes, including ALPHA EF-6000 and ALPHA EF-6808HF. During the expo, Alpha will have copies for review of I-Connect007’s The Printed Circuit Assembler’s Guide to... Low Temperature Soldering which was recently published and written by low-temperature solder experts from Alpha.
For electronic systems with higher reliability and safety requirements, Alpha will feature its family of low voiding, high reliability solder alloys and solder pastes including its new ALPHA® OM-358, OM-353,CVP-390, and InnoLot alloy. “Both the automotive electronics assembly market in Mexico and the electrification of automobiles continue to expand at a rapid pace,“ said Robert Wallace, Regional Marketing Manager for the Americas, “Alpha has products, processes, and support teams that can meet our customers‘ needs for performance, reliability, and low-cost of ownership.“
Alpha will also highlight its Recycling Services program. Alpha recycles scrap solder paste, debris, dross, and other tin-bearing materials from manufacturers throughout North America, and recently expanded its recycling capabilities throughout Mexico, having received an export license from SEMARNAT, the Department of Environment and Natural Resources in Mexico, to handle and transport nationalized scrap material. As North America’s largest solder recycler, Alpha takes pride in having the safest, most efficient, environmentally-compliant recycling solution that sends no materials to landfills.
Please visit Alpha at booth #49 and for additional information about Alpha’s industry-leading products and services, please click here.
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Brent Fischthal - Koh YoungSuggested Items
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.