-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
RF/Microwave eBook: Beneficial Tool for Engineers
October 22, 2018 | I-Connect007Estimated reading time: 1 minute
Released earlier this year, hundreds of engineers and other readers interested in PCB design have downloaded The Printed Circuit Designer’s Guide to… Fundamentals of RF/Microwave PCBs micro eBook.
This book is part of I-Connect007’s ongoing series, The Printed Circuit Designer’s Guide to…, which is specifically dedicated to educating PCB designers and serves as a valuable resource for readers seeking the most relevant information available. Written by American Standard Circuits’ John Bushie and Anaya Vardya, Fundamentals of RF/Microwave PCBs is a strong follow-up to their first design title, Flex & Rigid-Flex Fundamentals.
This book provides information needed to grasp the unique challenges of RF PCBs. The authors answer two main questions: what is the correct material to use for a particular project, and what can be done at the design stage to make a product more manufacturable? Readers, especially RF PCB designers, will gain a better understanding of issues related to the design and manufacture of RF/microwave devices from a PCB fabricator perspective.
“[This book] can be read in one sitting and speaks to engineering, design, layout, materials, and procurement,” commented Darren Smith, Athenatech U.S.A. "It’s a critical read for designers new to RF layout or combining multiple impedance environments."
Judy Warner, director of community engagement at Altium, stated, "This concise, yet very thorough book is destined to become every RF and microwave engineer's PCB fabrication bible. From material selection to skin-effect and the complexity of heat sink technology, ASC has shared every key aspect to fabricate these incredibly challenging boards successfully. Read it and watch your yields increase and your re-spins decrease!"
Download your free copy today! You can also view and download other titles in our full library.
We hope you enjoy The Printed Circuit Designer’s Guide to… Fundamentals of RF/Microwave PCBs.
For more information, contact:
Barb Hockaday
I-007eBooks
barb@iconnect007.com
+1-916-365-1727
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Teradyne Acquires TestInsight, Accelerating Time to Market for AI and Data Center Devices
04/16/2026 | BUSINESS WIRETeradyne, Inc., a leading provider of automated test equipment (ATE) and advanced robotics, announced it has acquired TestInsight, a leading provider of semiconductor test development, validation, and conversion software widely used across the industry.
Cadence, Google Scale AI Chip Design with ChipStack on Google Cloud
04/16/2026 | Cadence Design SystemsCadence, an industry leader in AI-driven computational software for semiconductor and system design, announced a strategic collaboration with Google to optimize the Cadence® ChipStack™ AI Super Agent with Gemini on Google Cloud.
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
04/15/2026 | SEMIElectronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.
April Issue of I-Connect007 Magazine: Beyond the Rulebook
04/14/2026 | I-Connect007 Editorial TeamIn this month’s I-Connect007 Magazine, we asked PCB designers, fabricators, and suppliers what it really means to operate without a rulebook. Their perspectives vary, especially between seasoned designers and experienced fabricators, but a common thread emerges: progress depends on pushing boundaries and finding a way forward, even when the path isn’t clear. In many ways, this mindset has always been part of what we do, whether we’ve called it that or not.
Powering the Future: Why Thermal Management Defines the Future of Electronics
04/15/2026 | Brian Buyea -- Column: Powering the FutureEvery leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.