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RF/Microwave eBook: Beneficial Tool for Engineers
October 22, 2018 | I-Connect007Estimated reading time: 1 minute

Released earlier this year, hundreds of engineers and other readers interested in PCB design have downloaded The Printed Circuit Designer’s Guide to… Fundamentals of RF/Microwave PCBs micro eBook.
This book is part of I-Connect007’s ongoing series, The Printed Circuit Designer’s Guide to…, which is specifically dedicated to educating PCB designers and serves as a valuable resource for readers seeking the most relevant information available. Written by American Standard Circuits’ John Bushie and Anaya Vardya, Fundamentals of RF/Microwave PCBs is a strong follow-up to their first design title, Flex & Rigid-Flex Fundamentals.
This book provides information needed to grasp the unique challenges of RF PCBs. The authors answer two main questions: what is the correct material to use for a particular project, and what can be done at the design stage to make a product more manufacturable? Readers, especially RF PCB designers, will gain a better understanding of issues related to the design and manufacture of RF/microwave devices from a PCB fabricator perspective.
“[This book] can be read in one sitting and speaks to engineering, design, layout, materials, and procurement,” commented Darren Smith, Athenatech U.S.A. "It’s a critical read for designers new to RF layout or combining multiple impedance environments."
Judy Warner, director of community engagement at Altium, stated, "This concise, yet very thorough book is destined to become every RF and microwave engineer's PCB fabrication bible. From material selection to skin-effect and the complexity of heat sink technology, ASC has shared every key aspect to fabricate these incredibly challenging boards successfully. Read it and watch your yields increase and your re-spins decrease!"
Download your free copy today! You can also view and download other titles in our full library.
We hope you enjoy The Printed Circuit Designer’s Guide to… Fundamentals of RF/Microwave PCBs.
For more information, contact:
Barb Hockaday
I-007eBooks
barb@iconnect007.com
+1-916-365-1727
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
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08/21/2025 | I-Connect007In this latest episode, Casey Kruger, director of product marketing at MKS’ ESI, joins On the Line With… host Nolan Johnson to share how CO₂ laser technology delivers faster, more accurate vias in a smaller, more energy-efficient footprint.
PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
How Good Design Enables Sustainable PCBs
08/21/2025 | Gerry Partida, Summit InterconnectSustainability has become a key focus for PCB companies seeking to reduce waste, conserve energy, and optimize resources. While many discussions on sustainability center around materials or energy-efficient processes, PCB design is an often overlooked factor that lies at the heart of manufacturing. Good design practices, especially those based on established IPC standards, play a central role in enabling sustainable PCB production. By ensuring designs are manufacturable and reliable, engineers can significantly reduce the environmental impact of their products.
Meet the Round 1 Winners of the Bright Manufacturing Student Challenge 2025
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University Of Minnesota Team Claims Victory In Bright Manufacturing Challenge 2025 Round 1
08/19/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced that Team "Rise and Grind Crew" from the University of Minnesota has emerged victorious in Round 1 of the Bright Manufacturing Challenge 2025.