Powering the Future: Why Thermal Management Defines the Future of Electronics
Standard of Excellence: Engineering Is the New Sales—How Technical Collaboration Wins Business
SMT Perspectives & Prospects: Artificial Intelligence, Part 7—Data Module 2
Alpha to Promote Advanced Sinter Technology at Power Electronics Show
October 22, 2018 | Alpha Assembly SolutionsEstimated reading time: 1 minute
Alpha Assembly Solutions will promote its range of high reliability silver sintering solutions, as well as its latest preform products for power semiconductor applications at the Power Electronics Expo, Moscow, Russia on October 23-25.
“Alpha’s Argomax silver sinter products have been designed to meet the power semiconductor market’s demand for increased die attach reliability and cost effective high volume manufacturing”, comments Ferenc Ago, area sales manager for Hungary and Russia at Alpha Assembly Solutions. “Argomax creates extremely high thermal and electrical conductivity silver bonds which deliver exceptional reliability as well as flexible bondline thickness for even the most challenging technologies.”
Alpha’s latest preform products for power semiconductor applications will also be featured at the show, including ALPHA TrueHeight. Preforms and ALPHA PowerBond Preforms. ALPHA TrueHeight Preforms prevent die tilt by enabling repeatable bondline thickness, which results in predictable reliability and performance. ALPHA PowerBond Preforms are based on a family of high reliability alloys containing antimony for increased strength and thermal fatigue resistance.
To learn more about Alpha’s solutions for power semiconductor applications visit us at booth #B221.
About Alpha Assembly Solutions
Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses, is the world leader in the development, manufacturing and sales of innovative specialty materials used for electronics assembly, die attach and semiconductor packaging in a wide range of industry segments, including automotive, communications, computers, consumer, power electronics, LED lighting, photovoltaics, and others.
As the electronics industry continues to evolve, Alpha is focused on developing novel and unique processes for solving assembly challenges. Whether traditional electronics assembly, die attach or emerging applications, such as flexible and formable electronics, Alpha designs solutions for manufacturing that looks at how multiple products can interact in the same environment to provide customers with the most effective assembly solution for their application.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality materials with a focus on sustainability and recycling services. For more information, click here.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
MEIKO Electronics Expands ASEAN Footprint with New Vietnam Subsidiary to Support Growing Demand
04/16/2026 | MeikoMEIKO ELECTRONICS CO., LTD. has announced that, at its Board of Directors meeting held on April 8, 2026, the company resolved to establish a wholly owned subsidiary, MEIKO ELECTRONICS YEN QUANG CO., LTD. (MKYQ), in Phu Tho Province, Vietnam.
What’s Next for PCB Materials? I-Connect007 Podcast Series Turns to Supply Chain Resilience
04/16/2026 | I-Connect007 Editorial TeamI-Connect007 continues its six-part podcast series with Isola experts titled, PCB Materials: The Backbone and Future of Electronics, with the release of Episode 5, which shifts focus to one of the industry’s most urgent challenges: supply chain resilience.
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
04/16/2026 | I-Connect007 Editorial TeamThe upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
KYZEN’s Award-Winning AQUANOX A4618 to Be Featured at SMTA Huntsville and Atlanta Expo & Tech Forums
04/15/2026 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Huntsville Expo & Tech Forum, scheduled to take place Tuesday, April 28.