-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSupply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Alpha to Promote Advanced Sinter Technology at Power Electronics Show
October 22, 2018 | Alpha Assembly SolutionsEstimated reading time: 1 minute
Alpha Assembly Solutions will promote its range of high reliability silver sintering solutions, as well as its latest preform products for power semiconductor applications at the Power Electronics Expo, Moscow, Russia on October 23-25.
“Alpha’s Argomax silver sinter products have been designed to meet the power semiconductor market’s demand for increased die attach reliability and cost effective high volume manufacturing”, comments Ferenc Ago, area sales manager for Hungary and Russia at Alpha Assembly Solutions. “Argomax creates extremely high thermal and electrical conductivity silver bonds which deliver exceptional reliability as well as flexible bondline thickness for even the most challenging technologies.”
Alpha’s latest preform products for power semiconductor applications will also be featured at the show, including ALPHA TrueHeight. Preforms and ALPHA PowerBond Preforms. ALPHA TrueHeight Preforms prevent die tilt by enabling repeatable bondline thickness, which results in predictable reliability and performance. ALPHA PowerBond Preforms are based on a family of high reliability alloys containing antimony for increased strength and thermal fatigue resistance.
To learn more about Alpha’s solutions for power semiconductor applications visit us at booth #B221.
About Alpha Assembly Solutions
Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses, is the world leader in the development, manufacturing and sales of innovative specialty materials used for electronics assembly, die attach and semiconductor packaging in a wide range of industry segments, including automotive, communications, computers, consumer, power electronics, LED lighting, photovoltaics, and others.
As the electronics industry continues to evolve, Alpha is focused on developing novel and unique processes for solving assembly challenges. Whether traditional electronics assembly, die attach or emerging applications, such as flexible and formable electronics, Alpha designs solutions for manufacturing that looks at how multiple products can interact in the same environment to provide customers with the most effective assembly solution for their application.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality materials with a focus on sustainability and recycling services. For more information, click here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
SINBON Celebrates Opening of New US Manufacturing Facility
08/21/2025 | PRNewswireLeading electronics system integrator SINBON Electronics Co., Ltd. held an opening ceremony on August 18 to celebrate its new 59,000-square-foot facility in Clayton, Ohio.
PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
Nano Silver Inks Market Forecast Report 2025-2030
08/20/2025 | Globe NewswireThe Nano Silver Inks Market is expected to grow from USD 427.415 million in 2025 to USD 836.160 million in 2030, at a CAGR of 14.36%.
VVDN Expands Manufacturing Footprint into the UAE to Meet Global Demand
08/20/2025 | PRNewswireVVDN Technologies, a global provider of software, product engineering and electronics manufacturing services & solutions, today announced it is setting up a new manufacturing facility in the UAE as part of its global expansion strategy.
Kimball Electronics Veterans ERG Members Proudly Participate in the 5th Annual Honor and Remember Run
08/20/2025 | Kimball ElectronicsVeterans and Military Service Advocacy (VMSA) Employee Resource Group (ERG) members Michael Mosher (Database Administration Engineer), Michael Stone (Test Technician Team Lead), and Joshua Belcher (Application Development Manager) took part in the 5th Annual Honor & Remember Run, a meaningful event dedicated to honoring fallen service members. The race featured a powerful memorial wall constructed from dog tags.