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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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AT&S Increases Guidance for the Financial Year 2018/19
October 24, 2018 | AT&SEstimated reading time: 1 minute
Based on the business development in the first quarter of the current year, the positive outlook for the coming months and taking into account seasonal effects in the fourth quarter of the current financial year 2018/19, the management has increased the forecast for revenue and earnings.
The very good business development is essentially attributable to higher revenue from the plants in Chongqing, which were in part still in the start-up phase in the previous year, as well as to measures to improve efficiency and productivity. In addition, the superior product portfolio for IC substrates (for example server applications) contributes to the increase in earnings.
As a result, AT&S now has the following expectations for the financial year 2018/19: based on stable exchange rates, the management expects revenue growth of 6 to 8% (previously up to 6%) and an EBITDA margin in the range of 24 to 26% (previously up to 23%) for the financial year 2018/19.
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