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Preparing for a New Laminate Supply Reality

08/26/2026 | Mark Goodwin, Ventec International Group
The global laminate industry has entered a period of structural change unlike anything seen in recent decades. Explosive investment in AI infrastructure, including AI servers, advanced networking, optical communications, and data centers, is driving demand for laminate materials at a pace the supply chain cannot match. The warning signs have been building for months. Extended lead times, repeated price increases, customer stockpiling, raw material allocation, and major capacity expansion announcements all point to an industry increasingly under strain. How prepared are individual companies to respond to these changes?

Coherent Begins Sampling 300mm SiC Substrates for AI Infrastructure

08/24/2026 | Coherent
Coherent Corp. , a global leader in photonics, announced that it has begun sampling of its 300mm high thermal conductivity silicon carbide (SiC) substrates to leading AI semiconductor partners.

Indium to Present Next Gen Semiconductor Packaging Solutions at PCIM Asia

08/24/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how key material innovations can collaboratively address cutting-edge advanced packaging process challenges at PCIM Asia 2026, August 26-28, in Shenzhen, China.

Qnity Advances Node Materials Innovation with KLA Inspection Technology

08/20/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced the installation of a Surfscan® SP7XP unpatterned wafer defect inspection system from KLA as part of its ongoing investment in advanced semiconductor materials innovation.

Below the Surface: Why Thermal Failure Is Still the No. 1 Killer in Power Electronics

08/18/2026 | Chandra Gupta -- Column: Below the Surface
Why do power electronics fail? There’s a range of answers, from overvoltage and mechanical stress to poor assembly and environmental exposure. If you ask your favorite AI search engine for an answer, you’ll get a pretty simple response: excessive temperature leads to component degradation, material breakdown, and eventual failure. In a sense, that’s true, but it’s oversimplified and incomplete. The real issue is thermal management failure at the system level. Heat is still the number one killer, and most of the time, you don’t even realize it’s there.
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