-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Ventec at electronica 2018: No Compromises for High-Frequency Materials
November 2, 2018 | Ventec International GroupEstimated reading time: 3 minutes

Ventec International Group will announce the launch of its extended ceramic-filled hydrocarbon thermoset material series designed for the world's most demanding high-frequency printed circuit board applications at this year’s electronica show in Munich. The global Ventec team will also be on hand in hall A1 at booth #468 to present the company’s unique laminate and prepreg capability across a very wide range of applications and budgets under the theme of ‘No more compromises: Price, Performance and Availability.'
From 13-16 November, electronica 2018 will be the global launch platform for Ventec's extended tec speed 20.0 range of ceramic-filled hydrocarbon thermoset material series. Combining unrivalled high-frequency performance (Dk 3.00-3.48/Df 0.002-0.0037), superior loss characteristics and the highest reliability with fast availability and efficient delivery through Ventec's fully controlled and managed global supply chain and technical support-network, the tec-speed 20.0 series offers excellent dimensional stability and uniform mechanical properties that help limit PIM. With the extended tec speed 20.0 range, Ventec has responded to customer demands for high-performance, reliable and cost-efficient high frequency materials that are supported by a fast and efficient global delivery promise and dependable technical support.
Other show highlights include:
Material Showcase
A special product & material showcase will demonstrate PCB material applications including a power module and a LED lighting module that illustrates examples of IMS boards combined with FR4 control boards made with Ventec’s high performance and highly reliable IMS materials like VT-4B5SP, VT-4B5L and VT-4B7. Automotive manufacturers around the world, including Ford, Tesla, VAG, Audi, Skoda, Seat, Volkswagen, Tata, Bentley, Daimler Benz, BMW, Renault-Nissan, Jaguar/Land Rover, Maclaren Automotive, already rely on Ventec's thermal management materials for a range of applications including LED headlights, ECU, break energy reclamation & e-power train establishing Ventec as a global leader in technology for high performance thermal management materials.
Announcing European Distribution Agreement for Thermal Interface Materials
As a perfect complement to Ventec’s IMS material families, thermally conductive and standard laminates and prepregs for multilayer PCB’s, Ventec has teamed up with EMI Thermal to provide a range of Thermal Interface Materials (TIM) to the European market. TIM is a thermally conductive medium used to fill the air gaps between mating surfaces in electronic components. Air is a poor conductor of heat and creates a thermal barrier which stops the transfer of heat between the component and its heatsink or chassis. EMI Thermal’s range of materials distributed through Ventec includes double sided thermal tape, electrical insulators, natural graphite and void fillers, that ensure reliability and performance and prevent electronic components from overheating and being damaged or burnt out.
With a one-stop-service solution for customers, Ventec also offers further distribution products to the European PCB and electronics industry including flexible laminates (ThinFlex/Arisawa) and a full range of PCB production consumable products covering standard and speciality (Centrum & Glossback) drill materials, copper foils including ACF.
Stock exchange Listing Celebration
Ventec is amid a transformative phase of its impressive history, having been successfully listed and trading on the Emerging Stock Market of the Taipei Stock Exchange since 16 January 2018 and currently completing the process for a TPEx Mainboard listing for early 2019. To celebrate the successful IPO as well as the launch of its latest product offerings, Ventec is looking forward to hosting show-visitors at its booth party on Wednesday, 14 November from 18:00 to 21:30.
About Ventec International Group
With volume manufacturing facilities and Headquarters in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the global PCB industry. For more information, click here.
Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
Suggested Items
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
04/03/2025 | Matt Stevenson -- Column: Connect the DotsI’ve been in this industry long enough to recognize red flags in PCB designs. When designers send over PCBs that look great on the computer screen but have hidden flaws, it can lead to manufacturing problems. I have seen this happen too often: manufacturing delays, yield losses, and designers asking, “Why didn’t anyone tell me sooner?” Here’s the thing: Minor design improvements can greatly impact manufacturing yield, and design oversights can lead to expensive bottlenecks. Here’s how to find the hidden flaws in a design and avoid disaster.
Real Time with... IPC APEX EXPO 2025: Tariffs and Supply Chains in U.S. Electronics Manufacturing
04/01/2025 | Real Time with...IPC APEX EXPOChris Mitchell, VP of Global Government Relations for IPC, discusses IPC's concerns about tariffs on copper and their impact on U.S. electronics manufacturing. He emphasizes the complexity of supply chains and the need for policymakers to understand their effects.