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Alpha’s Latest Innovations Target Temp-Sensitive Assemblies, High-Warpage Chips
November 12, 2018 | Alpha Assembly SolutionsEstimated reading time: 1 minute
Alpha Assembly Solutions will focus on its latest low-temperature solution for temperature-sensitive substrates and components as well as board and component warpage at electronica November 13-16, Munich, Germany.
Low-temperature assemblies can have many benefits including the ability to enable a smooth transition from wave soldering to a pin-in-paste process without the need to change any of the materials, as well reducing the thermal stress on components which leads to significantly lower failure rates. Low temperature processes also have an environmental benefit. As lower temperature assemblies require less energy the carbon footprint of the assembly facility is significantly reduced. This is of increasing importance as the electronics industry is often criticized for its lack of environmental awareness.
ALPHA® OM-550 HRL1 is a revolutionary high reliability low temperature solder paste designed to increase production yield and reduce component and board warpage. With a minimum peak temperature of only 185°C versus 245°C, ALPHA® OM-550 HRL1 greatly reduces the energy consumption of the SMT process.
The low temperature paste also delivers a vast improvement in reliability versus other low temperature alloys. Joints formed with ALPHA® OM-550 HRL1 have significantly improved mechanical reliability, whilst drop shock performance and thermal cycling reliability in mixed alloy joints improved by 100% and 20% respectively when using ALPHA OM-550 HRL1.
Alpha’s technical experts will be available at the MacDermid Enthone booth in Hall A1 Booth #527 at the electronica exhibition to discuss how ALPHA OM-550 HRL1 can benefit your low temperature assembly.
About Alpha Assembly Solutions
Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses, is the world leader in the development, manufacturing and sales of innovative specialty materials used for electronics assembly, die attach and semiconductor packaging in a wide range of industry segments, including automotive, communications, computers, consumer, power electronics, LED lighting, photovoltaics, and others.
As the electronics industry continues to evolve, Alpha is focused on developing novel and unique processes for solving assembly challenges. Whether traditional electronics assembly, die attach or emerging applications, such as flexible and formable electronics, Alpha designs solutions for manufacturing that looks at how multiple products can interact in the same environment to provide customers with the most effective assembly solution for their application.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality materials with a focus on sustainability and recycling services. For more information, click here.
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Sweeney Ng - CEE PCBSuggested Items
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On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
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Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.