Prices of High-Power LED Package Products Continue to Drop
November 13, 2018 | TrendForceEstimated reading time: 1 minute
The prices of high-power LED package products in the Chinese market continued to drop in October 2018, according to LEDinside, a division of TrendForce.
“The prices of high-power LED package products dropped in October because the costs of LED chips have been lowered in 3Q18, but the magnitudes of price decline varied”, says Terri Wang, LEDinside analyst. For example, prices of high power ceramic-substrate LEDs and 5-10W 7070 LEDs declined by 2%-5% and 4% respectively. On the other hand, prices of mid-power LED package products remained stable.
As the general lighting market has been growing mature with less growth momentum, LED manufacturers have put more focus on enhancing the added value of products and improving reliability, color performance, luminous efficacy, and so on. For instance, Lumileds has released its new LUXEON V2 LED, which delivers 150lm/W at 1A. It also enables DLC Premium at the system level, while 99% of the light is forward directed.
About TrendForce
TrendForce is a global provider of the latest development, insight, and analysis of the technology industry. Having served businesses for over a decade, the company has built up a strong membership base of 435,000 subscribers. TrendForce has established a reputation as an organization that offers insightful and accurate analysis of the technology industry through five major research divisions: DRAMeXchange, WitsView, LEDinside, EnergyTrend and Topology. Founded in Taipei, Taiwan in 2000, TrendForce has extended its presence in China since 2004 with offices in Shenzhen and Beijing.
Suggested Items
Imec Unveils Record-Low Loss 300mm RF Silicon Interposer for Sub-THz Systems
05/27/2025 | ImecAt the IEEE ECTC 2025 conference, imec – a world-leading research and innovation hub in nanoelectronics and digital technologies – highlights the exceptional performance and flexibility of its 300mm RF silicon interposer platform.
Promex Industries CEO Richard Otte Honored with IEEE Electronics Manufacturing Technology Award
05/27/2025 | PromexPromex Industries, Inc., a Silicon Valley-based provider of advanced design, packaging, and microelectronics assembly services, today announced that CEO Richard (Dick) Otte has received the 2025 Electronics Manufacturing Technology Award from the IEEE Electronics Packaging Society (EPS).
COMPUTEX 2025 Concludes Successfully AI Deployment Accelerates as Taiwan Solidifies Its Strategic Global Position
05/23/2025 | PRNewswireCOMPUTEX 2025 concluded today after four days of dynamic exhibitions and events. The show welcomed an impressive turnout, with 86,521 buyers from 152 countries, including Japan, the United States, South Korea, Vietnam, and India.
Imec Joins Forces with MIT’s RLE, MTL and IMES to Accelerate Personalized Healthcare
05/23/2025 | ImecImec, a leading research and innovation hub in nanoelectronics and digital technologies announced their collaboration with Massachusetts Institute of Technology (MIT), a renowned research university in advanced technology and science to research nanoelectronics-based solutions for minimally and non-invasive diagnostic devices for personalized medicine.
GlobalFoundries Partners with A*STAR to Accelerate Advanced Packaging Innovation
05/22/2025 | GlobalFoundriesGlobalFoundries (GF) announced plans to expand its capabilities in advanced packaging through a new Memorandum of Understanding (MOU) signed with the Agency for Science, Technology and Research (A*STAR), Singapore’s lead public sector research and development (R&D) agency.