The Right Approach: Get Ready for ISO 9001 Version 6
Dan’s Biz Bookshelf: ‘Still Broke: Walmart’s Remarkable Transformation'
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
Prices of High-Power LED Package Products Continue to Drop
November 13, 2018 | TrendForceEstimated reading time: 1 minute
The prices of high-power LED package products in the Chinese market continued to drop in October 2018, according to LEDinside, a division of TrendForce.
“The prices of high-power LED package products dropped in October because the costs of LED chips have been lowered in 3Q18, but the magnitudes of price decline varied”, says Terri Wang, LEDinside analyst. For example, prices of high power ceramic-substrate LEDs and 5-10W 7070 LEDs declined by 2%-5% and 4% respectively. On the other hand, prices of mid-power LED package products remained stable.
As the general lighting market has been growing mature with less growth momentum, LED manufacturers have put more focus on enhancing the added value of products and improving reliability, color performance, luminous efficacy, and so on. For instance, Lumileds has released its new LUXEON V2 LED, which delivers 150lm/W at 1A. It also enables DLC Premium at the system level, while 99% of the light is forward directed.
About TrendForce
TrendForce is a global provider of the latest development, insight, and analysis of the technology industry. Having served businesses for over a decade, the company has built up a strong membership base of 435,000 subscribers. TrendForce has established a reputation as an organization that offers insightful and accurate analysis of the technology industry through five major research divisions: DRAMeXchange, WitsView, LEDinside, EnergyTrend and Topology. Founded in Taipei, Taiwan in 2000, TrendForce has extended its presence in China since 2004 with offices in Shenzhen and Beijing.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
DARPA, State of New Mexico Establish Framework to Advance Quantum Computing
09/08/2025 | DARPAAs part of the Quantum Benchmarking Initiative (QBI), DARPA signed an agreement with the State of New Mexico’s Economic Development Department to create the Quantum Frontier Project.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.