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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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IPC APEX EXPO Executive Forum Focuses on Auto Electronics
November 15, 2018 | IPCEstimated reading time: 2 minutes
Senior-level executives from across the global electronics industry supply chain will gather to discuss challenges and opportunities of the burgeoning and rapidly changing automotive electronics industry during the IPC Executive Forum on Advancing Automotive Electronics at IPC APEX EXPO 2019. Presented by IPC’s Hall of Fame Council on January 28, the forum will focus on automotive electronics costs, reliability and programs from concept to production.
The Forum will include speakers from the United States, Asia and Europe to join the discussion on the challenges and opportunities for IPC and the electronics industry. Speakers include representatives from MacDermid-Enthone, Microtek Labs China, Elga Europe, Robert Bosch GmbH Germany, Nexteer Automotive, APTIV, Optimal+ and Ventec International Group.
“As the automotive industry increasingly incorporates electronics into its manufacturing, this provides a unique opportunity for IPC and our members to participate in this continually evolving field,” said Gene Weiner, Executive Forum program chair. “This Forum provides us with a chance to hear from subject matter experts about the many ways for involvement of our industry in automotive electronics.”
Topics will include materials in automotive electronic packaging, PCB reliability testing for automotive electronics, developing film photoresist to meet automotive fine line circuit needs, cost models with suppliers and understanding costs of new technology, developing and getting approval of new material for automotive electronics.
“We are thrilled that the Hall of Fame Council has put together such an important event for our members’ executives,” said Sanjay Huprikar, vice president of Solutions at IPC. “Following our June Automotive Electronics Forum in Nuremberg and the September launch of our new Reliability Council in Frankfurt, this upcoming event in January at IPC APEX EXPO directly supports IPC’s efforts to engage heavily with the transportation vertical.”
Information and registration for the Executive Forum on Advancing Automotive Electronics is available online, click here.
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Simon Khesin - Schmoll MaschinenSuggested Items
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