-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
MacDermid Enthone to Exhibit and Present at HKPCA
November 21, 2018 | MacDermid Electronics SolutionsEstimated reading time: 2 minutes
MacDermid Enthone Electronics Solutions to exhibit at HKPCA tradeshow, Shenzhen, China, December 5-7, 2018.
MacDermid Enthone’s circuit board expertise focuses this year on enabling technology trends such as the cost saving and miniaturization of MSAP and high frequency MacDermid Enthone and Alpha experts will be available at booth #6H31 to discuss the latest chemical and material solutions providing process predictability and smooth scale-up at every step.
Show attendees can stop by to obtain more information about the fully expanded MacuSpec acid copper metallization portfolio, and the high performance Systek brand of specialty metallizations for IC substrates including via filling, embedded trace plating, and bump metallization processes. In-depth details about their Modified Semi-Additive Process or MSAP and information on cost effective manufacturing solutions will be available as well.
Experts from the Alpha Assembly Solutions business will be present in the shared booth to talk about low temperature solder alloys, the EV focused silver sintering technology, and the wide range of assembly products offered by the organization.
These technologies are part of a suite of processing solutions that serve the electronics manufacturing supply chain at every step, from device design, through circuit board production, semiconductor metallization, component assembly, and OEM specification. Learn more at booth #6H31.
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. Visit us here.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is a global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others. For more information, click here.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
05/13/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.
KYZEN to Focus on Aqueous and Stencil Cleaning Solutions at SMTA Juarez Expo and Tech Forum
05/12/2026 | KYZENKYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, May 21 at Injectronics Convention Center in Ciudad Juarez, Chihuahua.
Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components
05/13/2026 | Nash Bell -- Column: Knocking Down the Bone PileUnderfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces.
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.