Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Anda Opens New Center for Excellence in Guadalajara
November 26, 2018 | Anda AutomationEstimated reading time: 1 minute
Anda Technologies will be opening its Guadalajara facility in early December at Prol. Av. Tepeyac 147, Paraísos del Colli 45069 Zapopan, Jalisco, Mexico.
Open to customers and engineers, the new center features a state-of-the-art demonstration and test room with 22 machines, including selective conformal coating, fluid dispensing, curing, conveying, energy-saving lead-free solder, reflow soldering machinery and more.
The facility also has a conference room in which Anda will host SMTA meetings as well as seminars on industry topics that will be open to the public. Additionally, engineers will be welcome to visit and bring their difficult-to-solve problems.
“Anda’s new facility in Guadalajara will allow the company to offer even faster response times, in addition to our proficient service through local, Spanish-speaking personnel. Anda’s Mexico central warehouse will be located at this site, as will a demo facility and general sales offices,” said Abby Tsoi, CEO of Anda Overseas Operations.
Anda Automation designs and manufactures selective conformal coating, fluid dispensing, UV/IR curing ovens, plasma treatment, conveying equipment, process lines and complete factory automation solutions for the electronics assembly industry.
About Anda Automation
Anda Automation was founded in 2008 with headquarters in Dongguan, China. The company also has offices in Fremont in California, Guadalajara in Mexico, Hong Kong, Suzhou & Changsha in China and 20 service centers worldwide. Anda develops high precision dispensing/coating valve, linear motor, servo linear guide, polymer mineral casting and optical assembly equipment. In the fluid application area, Anda offers unique technology to fabricate high precision dispensers, coating machines, UV & Thermal curing ovens and plasma cleaning equipment. For more information, click here.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.