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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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PCB Market to Witness a CAGR of 3.1% during 2018-2024
November 27, 2018 | Globe NewswireEstimated reading time: 2 minutes
The global printed circuit board (PCB) market was valued at $63.1 billion in 2017 and is expected to reach $76.9 billion by 2024, at a CAGR of 3.1%. Factors driving the growth of the market are; rising adoption of automation in various end-user industries, growing demand for wireless devices, increasing miniaturization of devices, surging need for more efficient interconnect solutions, and increasing demand for flexible circuits. Owing to the implementation of processors and sensors in smart gadgets, the size of the PCB has reduced to 74% approximately. Additionally, usage of flame retardant chemicals in PCBs to ensure fire safety, and increasing capital investment is further augmenting the market growth. Moreover, huge growth in the PCB market is also due to the increasing demand for smart tablets and smart phones in IT and consumer electronics sector. Growth in wearable electronics is emerging as a key opportunity in the PCB market.
A PCB is made up of laminated material (copper plus a dielectric) that offers the interconnection for electronic components and integrated circuits. To place electronic components in an insulated board, holes are created with the help of drillers. To maintain the components' stability in a circuit board, they are soldered on the board, and are then connected through copper tracks. PCBs are used to electrically connect the components and provide a base on which the entire system can be integrated.
Growing Awareness Regarding Environmental Friendly Printed Circuit Board
Advancements in technology have led to an increased number of new electronic products in the market, and the trend is likely to continue in the coming years. However, massive production of PCBs is becoming unfriendly to environment, due to the usage of wet chemicals in their manufacturing. Moreover, lack of recycling ability also affecting the adoption rate of printed circuit boards. To ensure less toxic emissions into the environment, ink jet printing technology is used in the manufacturing of PCBs. This technology enables the cost-effective manufacturing of thin, flexible and disposable electrical devices.
Global Printed Circuit Board (PCB) Market – Regional Insight
Asia-Pacific held the largest market share of the global PCB market in 2017, with around 77% of the market share. The growth in APAC is attributed to the presence of many semi-conductor manufacturers, and growing adoption of smart devices in the region. North America held the second largest share of the global market in 2017, owing to the high demand from military and aerospace sector.
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Simon Khesin - Schmoll MaschinenSuggested Items
I-Connect007 Releases The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication
05/15/2026 | I-Connect007As PCB complexity continues to accelerate, fabricators and OEMs are reevaluating long-standing manufacturing processes to meet the demands of AI, HDI, advanced packaging, and next-generation electronics. To address these evolving challenges, I-Connect007 is proud to announce the release of The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication, authored by MacDermid Alpha Solution’s Carmichael Gugliotti.
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.