Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Early Bird Deadline for EIPC Winter Conference Milan 2019
December 12, 2018 | EIPCEstimated reading time: Less than a minute
The early bird deadline for EIPC’s Winter Conference in Milan, Italy, on February 14–15, 2019, is fast approaching. Those who are keen to attend the event have until December 15 to take advantage of the early bird discount.
EIPC’s Winter Conference will feature familiar faces in the industry, including Walt Custer and Alun Morgan, as well as Uwe Altmann, Don Monn, Hermann Reischer, Emma Hudson and Tarja Rapala-Virtanen, delivering keynotes and presentations.
For more information on the program, click here.
To register, click here.
Share on:
Suggested Items
EWPTE 2025: Wire Processing Innovation Driving Technical Dialogue
05/13/2025 | Brittany Martin, I-Connect007From cutting-edge automation to advanced testing and harness assembly solutions, the 2025 Electrical Wire Processing Technology Expo (EWPTE) delivered a packed exhibit floor, robust technical programming, and valuable peer-to-peer connections.
PCB East Continues to Expand
05/06/2025 | Andy Shaughnessy, Design007 MagazineIt was a perfect week for a conference and trade show in metropolitan Boston, with high temperatures in the 70s. PCB East took place at the Boxboro Regency Hotel and Conference Center April 29–May 2, with the expo on April 30. PCB East has been expanding since its relaunch a few years ago, with conference and show attendance rising each year.
KYZEN’s Adam Klett to Present at 2025 SMTA Electronics in Harsh Environments Conference
05/05/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, announced today that Director of Science Adam Klett, PhD will present during the technical conference at the 2025 SMTA Electronics in Harsh Environments Conference.
SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
05/05/2025 | SEMISEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.
EIPC Summer Conference 2025: PCB Innovation in Edinburgh
04/18/2025 | EIPCEIPC have very wisely selected this wonderful city in Scotland as the venue for their Summer Conference on June 3-4. Whilst delegates will be distilling the proven information imparted by the speakers in the day, in the evening they will be free spirits at the Conference Dinner.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in