Nolan’s Notes: Everyone Has Their Eye on India
Standard of Excellence: The Human Touch in an Automated World
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
Indium Features Gold Alloy Solder Preforms at SPIE Photonics West
December 13, 2018 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation will feature its precision gold alloy solder preforms at the SPIE Photonics West event, February 2-7, in San Francisco, California.
Indium Corporation’s AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability joining and sealing. AuSn preforms are designed for high-reliability applications, such as laser, photonics, microwave systems, medical, and aerospace.
Depending on the alloy, gold-based solders have a melting point ranging from 280-1,064°C, making them compatible with subsequent reflow processes. In addition, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength.
Semiconductor-grade AuSn preforms are designed specially to meet the challenges facing RF and power semiconductor devices as they continue to get smaller, with increasing power density and power ratings.
Indium Corporation’s Pb-free and RoHS-compliant AuSn solder preforms are available in a variety of standard and custom-engineered designs. The Gold Preform Quick Turn Program offers engineering support from design to production and a quick turnaround for new design, tool, or prototype quantities.
For more information about Indium Corporation’s gold alloy solder preforms, visit us at booth #3310.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.
Dr. Jennie Hwang to Present on ‘Solder Joint Reliability’ at SMTA International 2025
09/03/2025 | Dr. Jennie HwangDr. Jennie Hwang to address “Solder Joint Reliability” at the 2025 SMTA International Conference on Monday, October 20. Leveraging her decades of extensive real-world experiences and deep knowledge,
Indium to Highlight Energy-Efficient, High-Reliability Solder Solutions for EV and Electronics at Productronica India
09/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at Productronica India, to be held September 17-19 in Bengaluru, India.
Altus Supports Datalink Electronics with Advanced Selective Soldering Solution to Boost Manufacturing Efficiency
09/02/2025 | Altus GroupDatalink Electronics has partnered with Altus Group to integrate a cutting-edge automated soldering solution, enhancing its production capabilities and reinforcing its strategic focus on quality, automation, and scalability.
Connect the Dots: How to Avoid Five Common Causes of Board Failure
09/04/2025 | Matt Stevenson -- Column: Connect the DotsBoards fail for various reasons, and because I’ve been part of the PCB industry for a long time, I’ve seen most of the reasons for failure. As part of my ongoing crusade to help designers design for the reality of manufacturing, here are five common causes for board failure and how to avoid them.