-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Gen3 Introduces AutoSIR2 + and AutoCAF2+
December 13, 2018 | Gen3 SystemsEstimated reading time: 1 minute
SIR and CAF testing have become significant demands by the industry in the drive to improve and enhance electronic circuit reliability.
As an example, the evolution of electric vehicles and driverless technology AKA EV’s, show that the three phase developments will be 470V; 850V and 1,250V continuous operation. Testing under these conditions requires extreme health and safety precautions, especially as the tests are performed in damp / heat chambers at typically 850C / 85% RH for up to and beyond 2,500 hours.
Other applications however, show demand for ultra-low voltage testing at
Gen3 has a continuous product development program to meet the ever-changing demands of both our existing and new customers. We are proud to introduce the new AutoSIR2+ and the AutoCAF2+ instruments.
These incorporate new and greatly improved software that provides superior flexibility and which also permit simultaneous tests at up to 4 different voltages. The user can select 3 voltages from the choice of 0V; 3.3V; 5V; 10V; 12.5V; 15V; 50V and 100V. In addition, by using an external power supply, an additional test may, simultaneously, be run at up to 1,250V.
The Gen3 Systems AutoSIR2+ system represents a dramatic improvement over existing SIR test alternatives, and its shielded precision electronics allows for state-of-the-art accuracy resistance measurements to be made up to 1014 Ω.
About Gen3 Systems
Gen3 Systems is a specialist manufacturer of test and measurement equipment used to help predict reliability of electronic circuits and systems in the field. In addition, the company designs and manufactures dip and spray coating process equipment in both in-line and bench-top formats. Gen3 is a specialist distributor for several leading equipment manufacturers including, Nordson SELECT, FineTech, MBTech, MEK, Hirox, and, Aprotec Instrumentation, solder paste inspection (SPI) systems.
Gen3 Systems also provides training, equipment and expertise for manufacturers requiring assessment of their electronic products’ reliability. The company also operates a test service and assists with standards development via both the IPC, IEC, and UL. Gen3 Systems operates from premises near Farnborough Business Park, on the M3 corridor and just 30 minutes from London’s Heathrow Airport.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.