-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Best Technical Paper at IPC APEX EXPO 2019 Selected
December 18, 2018 | IPCEstimated reading time: 1 minute
The best technical conference paper of IPC APEX EXPO 2019 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, January 29, 2019.
Taking top honors, the winning paper is, “Reducing Dust Deposition on Electronic Equipment by Optimizing Cooling Air Flow Patterns” by Chen Xu, Nokia. His co-author was: Jason Stafford, Imperial College London. This paper will be presented during Technical Conference Session 36 (Surface Finish Reliability/ Gold Brush Plating Repair/ Creep Corrosion) on Thursday, January 31.
This year, two papers were selected in the honorable mention category. Honorable mention went to, “Head-on-Pillow Defect Detection – X-ray Inspection Limitations” by Lars Bruno, Ericsson AB. His co-author was: Benny Gustafson, Ericsson AB. This paper will be presented during Technical Conference Session 3 (Assembly/Inspection -- BTC/ BGA) on Tuesday, January 29.
Honorable mention also goes to “Analyzing a Printed Circuit Board with Oxide Residue Contamination” by Wade Goldman, The Charles Stark Draper Laboratory, Inc. His co-authors were: Andrew Dineen; Hailey Jordan; Curtis Leonard, The Charles Stark Draper Laboratory, Inc.; and Edward Arthur, Raytheon Company, Space and Airborne Systems. This paper will be presented during Technical Conference Session 25 (Failure Analysis) on Wednesday, January 30.
The papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry.
Suggested Items
Real Time with… IPC APEX EXPO 2024: The Driving World of e-Mobility with Indium
05/08/2024 | Real Time with...IPC APEX EXPOIn the competitive EV market, technology plays a crucial role facing the challenges of infrastructure. As Brian O'Leary explains, Indium's e-Mobility product suite includes proven solder and thermal management products for high reliability.
Real Time with… IPC APEX EXPO 2024: Understanding Objective Evidence in Manufacturing Processes
05/07/2024 | Real Time with...IPC APEX EXPOGraham Naisbitt explains the importance of objective evidence in manufacturing processes, debunking the common misconception that the ROSE test is a cleanliness test. He also discusses the introduction of Rev J, a requirement for measuring ionic contamination on circuit assemblies, and the challenges in accurately measuring contamination. Alternative methods like ion chromatography and the need for updating standards like the ROSE test are mentioned.
Real Time with… IPC APEX EXPO 2024: My Role as a Technology Solutions Director
05/02/2024 | Real Time with...IPC APEX EXPOPeter Tranitz, senior director of technology solutions at IPC, shares insights into his role as the design initiative lead. He details his advocacy work, industry support, and the responsibilities of the design initiative committee. The conversation also covers the revamping of standards, the IPC Design Competition, and the implementation of design rules in software tools.
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.