-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Best Technical Paper at IPC APEX EXPO 2019 Selected
December 18, 2018 | IPCEstimated reading time: 1 minute
The best technical conference paper of IPC APEX EXPO 2019 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, January 29, 2019.
Taking top honors, the winning paper is, “Reducing Dust Deposition on Electronic Equipment by Optimizing Cooling Air Flow Patterns” by Chen Xu, Nokia. His co-author was: Jason Stafford, Imperial College London. This paper will be presented during Technical Conference Session 36 (Surface Finish Reliability/ Gold Brush Plating Repair/ Creep Corrosion) on Thursday, January 31.
This year, two papers were selected in the honorable mention category. Honorable mention went to, “Head-on-Pillow Defect Detection – X-ray Inspection Limitations” by Lars Bruno, Ericsson AB. His co-author was: Benny Gustafson, Ericsson AB. This paper will be presented during Technical Conference Session 3 (Assembly/Inspection -- BTC/ BGA) on Tuesday, January 29.
Honorable mention also goes to “Analyzing a Printed Circuit Board with Oxide Residue Contamination” by Wade Goldman, The Charles Stark Draper Laboratory, Inc. His co-authors were: Andrew Dineen; Hailey Jordan; Curtis Leonard, The Charles Stark Draper Laboratory, Inc.; and Edward Arthur, Raytheon Company, Space and Airborne Systems. This paper will be presented during Technical Conference Session 25 (Failure Analysis) on Wednesday, January 30.
The papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry.
Suggested Items
IPC Hall of Fame Spotlight Series: Highlighting Patty Goldman
11/22/2024 | Dan Feinberg, I-Connect007In my first article of this special series, I wrote a synopsis of the IPC Raymond E. Pritchard Hall of Fame (HOF) Award, along with a commentary on its first few members, particularly Pritchard. Over the years, IPC members who have contributed significantly to IPC and our industry have been awarded this high honor and recognition. Though many early HOF members have passed away and are unknown to today’s IPC membership, their contributions still resonate. Over the coming months, I look forward to researching and reporting on IPC Hall of Fame members and their contributions. This month, I highlight Patty Goldman.
Winners of IPC Hand Soldering World Championship at electronica 2024 Announced
11/21/2024 | IPCIPC hosted its Hand Soldering World Championship in Munich, Germany, at electronica on 14-15 November 2024, welcoming 14 competitors from 13 companies and 12 countries worldwide. Skilled contestants competed to build an electronics assembly in accordance with IPC-A-610 Class 3 criteria, and were judged on the functionality of the assembly, compliance with the assembly process and overall product quality. The contestants were allowed a maximum of 60 minutes to complete the assembly.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
Enjoy the Journey: PCB Design Instructor Kris Moyer on His Sustainable Lifestyle
11/19/2024 | Michelle Te, IPC CommunityWhen I contacted IPC design instructor Kris Moyer to discuss his sustainable lifestyle, he responded to my text with a call. "I'm calling you from about 8,000 feet, sitting at the foot of Mammoth Lakes," he told me. “My friends and I are about to get in the pool for the afternoon." Kris can do this because he actually lives full-time in his travel-trailer at this campground. He's now a permanent camper, taking him anywhere the winds blow—and where there's strong internet service—so he can teach his PCB design classes, offer expert interviews, and live off the land.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.