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Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
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Top 10 Most-Read SMT007 Columns of 2018
December 31, 2018 | Stephen Las Marias, I-Connect007Estimated reading time: 3 minutes
Here are the top 10 most-read SMT007 columns from the past year.
New Year Resolutions and Best Wishes
The New Year stands before us, like a chapter in a book, waiting to be written. We can help write that story by setting goals. But the true challenge is to keep these goals from falling into a wish list and to know how to stick to those goals and when. I hope that in this year to come, goals give us direction in whatever we do, be it on AI, 5G, mixed reality and quantum computing or the next chip design.
One World, One Industry: Skilled Talent—Can We Meet Rising Demand?
In 2018, the U.S. GDP is expected to continue its rise, while unemployment rates are expected to drop further. Experts agree that the global economy is also showing signs of strengthening.
Cross Border Deals: What to Look for and How to Manage
My firm has been approached by foreign firms several times this year and in 2017 who want to acquire PCB, PCBA, or other electronics companies in North America.
Raising the Capability Ceiling: SMTA Upper Midwest Chapter Expo
An energetic and engaged crowd filled the recent SMTA Upper Midwest Expo & Tech Forum. The event, held in June 14 in Minneapolis, Minnesota, hosted 57 exhibiting companies and had over 100 pre-registered attendees. The underlying theme for the technical presentations was "Raising the Capability Ceiling!" Here's a wrap-up of the event.
Fact or Myth: Do 80% of M&A Deals Fail?
We are often asked by business owners if the commonly quoted figure is true that 80% of mergers fail to meet expectations after closing. There is a fair amount of research on large ($1 billion+), public deals that suggests that the 80% post-closing failure rate may be true.
Replating of Gold Fingers: Getting the Shine Back
There are several instances where the gold contacts on PCBs need to be replated, and IPC A-610 discusses several of these cases. This column by Bob Wettermann discusses gold replating of defective contacts caused by processes such as wave or selective soldering, or plating.
Filling the Gap: Underfill Rework
Rework technicians must take into account a variety of factors when considering whether or not to rework underfilled components, such as BGAs, CSPs, flip chips, and other component packages on handheld devices. But without a full understanding of the underfill characteristics, expect the outcome to be low yields unless the board was designed with reworkability in mind.
Masking of Conformal Coating During Assembly and Rework
Masking of printed circuit boards post rework/repair as well as for initial PCB assembly is often required if the PCB is to be conformal coated. If a board that has conformal coating on it needs to be reworked or repaired, the conformal coating needs to first be removed before the operation of rework or repair can take place. This column centers around the various options for conformal coating masking via a liquid application process.
How to Prepare for a Smooth Post-M&A Deal Transition
Selling a company is an exciting process, as well as time-consuming, stressful, and complex. Both sellers and buyers are sometimes so caught up in the deal that they forget to properly plan the post-deal integration.
SMT Manufacturing: Why Soldering?
Upcoming AI hardware requires advanced semiconductors, packaging approaches, new architectures, increased speeds and capabilities of inference processing, and system design and manufacturing prowess continually developed to reach the interconnect density. Against this backdrop, packaging and assembly levels will continue to be critical technology and serve as the backbone of manufacturing electronic hardware to deliver desired products with enhanced miniaturization, functionality, and augmented intelligence promptly.
Suggested Items
Real Time with… IPC APEX EXPO 2024: Insulectro on Attracting Young Talent to the Electronics Manufacturing Industry
05/16/2024 | Real Time with...IPC APEX EXPOInsulectro's Doug Gotelli and Mitchell Benson explore the challenges of drawing young talent into the electronics manufacturing industry. They underscore the significance of manufacturing and the urgency of tackling the workforce shortage. They also discuss internship programs, the industry's resilience amid the pandemic, and the rewarding experiences of working in this sector.
Siemens, Foxconn Team Up to Optimize Forward-thinking Manufacturing
05/16/2024 | FoxconnSiemens AG, a leading technology company, and Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer, have signed a memorandum of understanding (MoU) to drive digital transformation and sustainability in smart manufacturing platforms.
TRI Opens New Manufacturing Facility
05/16/2024 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, announced that it has opened a state-of-the-art R&D and manufacturing facility.
SEMICON West 2024 to Spotlight U.S. Chip Industry Investments, Supply Chain Resilience, Talent, and Global Growth and Innovation
05/15/2024 | SEMISEMICON West 2024 will gather industry experts and leaders July 9-11 at the Moscone Center in San Francisco for insights into the latest trends and innovations in sustainability, supply chain management, workforce development and other critical industry issues.
Using AI to Redefine Productivity
05/15/2024 | Nolan Johnson, SMT007 MagazinePlato Systems, a machine perception company spun out of Stanford University, employs AI and video data to analyze and optimize the human component in manufacturing. Initially focused on semiconductors, Plato Systems has expanded into EMS manufacturing. Co-founder and CEO Amin Arbabian, along with product advisor Anders Holden and head of growth Luis Vidal, discuss their approach to changeover optimization and its impact on productivity in the industry. They’ve also included customer Raj Vora in the conversation.