Dan's Biz Bookshelf: 'Move Your Bus'
Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Solder Materials Market Size Worth $1.41 Billion by 2025
December 27, 2018 | Grand View Research, Inc.Estimated reading time: 1 minute
The global solder materials market size is anticipated to reach $1.41 billion by 2025 expanding at a CAGR of 3.4%, according to a new report by Grand View Research, Inc. Rising demand for advanced consumer electronics and resultant rise in gadget repair and refurbishing activities is expected to boost the demand for soldering processes. Introduction of lead-free solders due to stringent regulations against the lead toxicity is expected to propel the industry growth over the forecast period. Rising usage of new solid-state semiconductor technologies in consumer and industrial applications is also anticipated to support the market development.
The nano-paste and sub-micron particles are expected to gain traction due to characteristics, such as lower melting point temperatures, large surface energy, large surface area per unit volume, and super magnetism. The usage of low-cost, non-patented alloy formulations in place of patented products is predominant in the industry. However, the use of non-patented alloys may hamper the overall product quality, which is expected to have a negating impact on the industry growth in the years to come.
Further key findings from the study suggest:
- The wire product segment is expected to witness the highest CAGR reaching at $544.6 million by 2025. This growth is attributed to high product demand in component miniaturization in electronic devices
- Solder paste has also witnessed a significant growth owing to advancements in micron- and sub-micron particles
- Usage of solder materials through robotic process generated a revenue of $321.5 million in 2017 as a result of increased automation across various industries, such as industrial manufacturing
- The industry is highly competitive in nature and is driven by innovations and material and technological advancements
- Prominent companies in the global solder materials market emphasize on the production of advanced materials to have a competitive edge over others
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.