-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Orbotech and KLA-Tencor Pursue Merger Clearance in China
December 27, 2018 | OrbotechEstimated reading time: Less than a minute
KLA-Tencor Corporation and Orbotech Ltd. announced that KLA-Tencor continues to have advanced discussions with the State Administration for Market Regulation of the People’s Republic of China (SAMR) regarding clearance of the proposed merger involving KLA-Tencor and Orbotech with a goal of obtaining clearance as soon as practicable in 2019.
Suggested Items
EIPC to Hold Summer Conference in Munich
05/31/2023 | EIPCIf you have never been to Munich, then you are probably not working in the PCB industry. Well, you may be, but then if you have never attended Productronica or Electronica, a bi-annual gathering in Munich of the illustrious companies who are the foundations of it, then that’s a shame.
EIPC Winter Conference 2023: Day 1 Review
02/27/2023 | Pete Starkey, I-Connect007The EIPC Winter Conference returned to the Metropolis of Lyon in eastern France this month. In 2018, the venue was Villeurbanne in the Auvergne-Rhône-Alpes region. Five years later the setting was the Groupama Stadium in Décines-Charpieu, and leaders of the European printed circuit community gathered in expectation of a spectacular programme of 16 presentations, a visit to a nuclear power station, and an invaluable networking opportunity. They weren’t disappointed.
Multicircuits Installs New Fully Automated Orbotech Sprint 200 Legend Printer
12/23/2022 | MulticircuitsMichael Thiel, VP of Operations at Multicircuits announced recently that the company, in their continued commitment to purposeful automation, selected and installed a new Orbotech Sprint 200 Legend Printer.
Multicircuits Installs New Fully Automated Orbotech 600 LDI
12/07/2022 | MulticircuitsMichael Thiel, VP of Operations at Multicircuits, announced the installation of a new Orbotech 600 LDI with Technosystem automation.
A Sharper Image
10/24/2022 | I-Connect007 Editorial TeamWe recently spoke with Loren Davidson, a senior manufacturing engineer at TTM Technologies in Chippewa Falls, Wisconsin. In this wide-ranging discussion, Loren details the medium-volume facility’s imaging processes and equipment, a variety of imaging tricks of the trade, and why it’s so important to make decisions based on solid statistical data.