Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Ersa to Introduce Rework and Soldering Systems at IPC APEX EXPO
January 2, 2019 | ErsaEstimated reading time: 1 minute
Kurtz Ersa Inc. will exhibit at IPC APEX EXPO 2019, scheduled to take place January 29-31, 2019 at the San Diego Convention Center in California. The company will introduce the HR 600 XL and the VERSAFLOW 4XL with VERSAFLEX in booth 2706.
With the Ersa HR 600 XL, it is possible to professionally rework BTC components on big board assemblies. Boasting a heated area of 24 x 24 inch and a PCB thickness of up to 10 mm opens up rework capabilities in the segments of telecommunication, network and infrastructure.
The HR 600 XL features a bottom-side IR Matrix heater with a total power of 15 kW that consists of 25 individually controllable heating elements. For each application the ideal heat distribution can be set. The highly efficient 800 W hybrid heating head executes the component desoldering or installation from chip resistors to 60x60 mm (2.36x 2.36 inch) BGAs or sockets in well-known Ersa quality.
The VERSAFLOW 4XL is designed for PCB sizes of up to 610 x 1,200 mm. This selective soldering system provides a revolutionary new dimension of flexibility and application variety – at the highest soldering quality.
Printed circuit board (PCB) formats of up to 610x1,200 mm can be soldered efficiently and safely with the VERSAFLOW 4XL, making it a perfect system for large, highly integrated assemblies or LED applications. Featuring the completely new VERSAFLUX flux module and VERSAFLEX solder module, the VERSAFLOW 4XL is extremely flexible and manages most diverse solder jobs.
Ersa also will display the VERSAFLOW 455 selective soldering system, Smartflow 2020 selective soldering system, N2 Generator, Hotflow 3/20 reflow oven, Powerflow Air, VERSAPRINT Ultra with the latest measuring technology via 3D camera, and HR550 & HR600/2 rework systems. Additionally, the company will show automation solutions (conveyors, lifts, etc.), as well as hand tools.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.