-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Ersa to Introduce Rework and Soldering Systems at IPC APEX EXPO
January 2, 2019 | ErsaEstimated reading time: 1 minute

Kurtz Ersa Inc. will exhibit at IPC APEX EXPO 2019, scheduled to take place January 29-31, 2019 at the San Diego Convention Center in California. The company will introduce the HR 600 XL and the VERSAFLOW 4XL with VERSAFLEX in booth 2706.
With the Ersa HR 600 XL, it is possible to professionally rework BTC components on big board assemblies. Boasting a heated area of 24 x 24 inch and a PCB thickness of up to 10 mm opens up rework capabilities in the segments of telecommunication, network and infrastructure.
The HR 600 XL features a bottom-side IR Matrix heater with a total power of 15 kW that consists of 25 individually controllable heating elements. For each application the ideal heat distribution can be set. The highly efficient 800 W hybrid heating head executes the component desoldering or installation from chip resistors to 60x60 mm (2.36x 2.36 inch) BGAs or sockets in well-known Ersa quality.
The VERSAFLOW 4XL is designed for PCB sizes of up to 610 x 1,200 mm. This selective soldering system provides a revolutionary new dimension of flexibility and application variety – at the highest soldering quality.
Printed circuit board (PCB) formats of up to 610x1,200 mm can be soldered efficiently and safely with the VERSAFLOW 4XL, making it a perfect system for large, highly integrated assemblies or LED applications. Featuring the completely new VERSAFLUX flux module and VERSAFLEX solder module, the VERSAFLOW 4XL is extremely flexible and manages most diverse solder jobs.
Ersa also will display the VERSAFLOW 455 selective soldering system, Smartflow 2020 selective soldering system, N2 Generator, Hotflow 3/20 reflow oven, Powerflow Air, VERSAPRINT Ultra with the latest measuring technology via 3D camera, and HR550 & HR600/2 rework systems. Additionally, the company will show automation solutions (conveyors, lifts, etc.), as well as hand tools.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.