-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
VJ Electronix to Demo Automation at IPC APEX EXPO 2019
January 3, 2019 | VJ Electronix, Inc.Estimated reading time: 1 minute

VJ Electronix will exhibit in booth no. 3405 at the IPC APEX EXPO 2019, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will demonstrate the latest enhancements to its rework and X-ray product lines.
The revolutionary XQuik II with AccuCount Technology is now available with full material handling automation. The leading component counting system may be paired with load/unload buffers, robotic transfer and automatic bar code reading for hands off operation. The robotic handling system may be configured with multiple buffers and interfaced directly with storage systems.
Based on the popular Summit 1800i, the new Summit 2200i offers additional automation. VJE has maintained the benefits of high efficiency convection heating, precision placement and the renowned 1-2-3-Go interface, coupled with a second rework head to allow continuous process from removal, to site dressing and component replacement. Fiducial recognition and automatic alignment eliminate operator intervention and allow multiple components to be reworked consecutively.
Also on display will be the new low-cost, high-performance eValuCT. The eValuCT is a bench top Computed Tomography system providing high resolution 3D imaging and reconstruction for electronic packages, sensors, connectors and other small samples. With a very simple user interface, 3D inspection can be available to your entire team without the need for assistance from a highly trained operator.
The Vertex II incorporates the latest advances in X-ray imaging components with off-axis viewing, all in a smaller footprint. The system offers VJ’s proven production readiness, superior uptime and unmatched value. The Vertex II, now CT ready, is equipped with a standard high contrast, high resolution CMOS digital detector, and can be configured with a variety of X-ray sources and optional detectors to meet specific application needs including large boards and heavy samples.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.