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Biden-Harris Administration: Akash Systems to Support Emerging Semiconductor Technology

11/14/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the Department of Commerce and Akash Systems have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $18.2 million in proposed direct funding under the CHIPS and Science Act.

Siemens Unveils Next Generation AI-enhanced Electronic Systems Design Software

11/13/2024 | Siemens
Siemens Digital Industries Software announced today the latest advancement in its electronic systems design portfolio. The next generation release takes an integrated and multidisciplinary approach, bringing together Xpedition™ software, Hyperlynx™ software and PADS™ Professional software into a unified user experience that delivers cloud connectivity and AI capabilities to push the boundaries of innovation in electronic systems design.

Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering

11/13/2024 | Rehm Thermal Systems
Rehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.

X-59 Engine Roars, Lockheed Martin Starts Last Major Ground Test

11/12/2024 | Lockheed Martin
Lockheed Martin Skunk Works, in partnership with NASA Aeronautics, started X-59 engine run testing, marking the aircraft's final major system check-out before taxi tests and first flight. The tests also mark the first time the X-59 was powered fully internally. 

HENSOLDT, Lockheed Martin Sign a Memorandum of Understanding

11/12/2024 | Lockheed Martin
On 7 November 2024, Oliver Dörre, CEO of HENSOLDT AG and Paul Lemmo, vice president and general manager Integrated Warfare Systems and Sensors at Lockheed Martin, signed a Memorandum of Understanding on a potential cooperation in the field of maritime command and control systems and radar technologies.
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