Dan's Biz Bookshelf: 'Move Your Bus'
Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Candor Builds 3 Mil Space Selective Hard Gold PCBs with Full Sidewall Coverage in Five Days
January 7, 2019 | Candor CircuitsEstimated reading time: Less than a minute
Toronto PCB fabricator Candor Circuits has recently produced selective hard gold printed circuits boards with full sidewall coverage, at 3-mil spacing in just five days.
“Candor prides itself with the ability to respond to and manufacture complex PCB build requirements quickly. Recently we have encountered a larger number of customers that require selective hard gold for contact in connector/bga areas, with via in pad technology. The spacing requirements necessary for these boards require advanced imaging technology to handle the registration, as hard gold does not etch. Candor’s advanced technology and technique allow for consistent etch resist and even allows side walls to be hard gold plated,” said Sunny Patel, Candor’s technical sales manager.
“Many of our customers need a quick-turn solution for rapid processing of evaluation boards and prototypes. Our unique process eliminates several steps, which typically add lengthy processing time. This, combined with a simplified process philosophy, allows our customers get even their more complex boards on time,” Patel continued.
Candor strives to continue pushing the boundaries of complex PCB fabrication and encourages anyone with difficult projects to contact them directly for more information about building their boards.
Share on:
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.