Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
KIC and Indium to Hold Voiding Clinic at IPC APEX EXPO 2019
January 8, 2019 | Indium CorporationEstimated reading time: Less than a minute
KIC and Indium Corporation will hold a voiding clinic in booth #1215 at the IPC APEX EXPO 2019, scheduled to take place January 29-31 at the San Diego Convention Center.
Two of the most effective ways to reduce voiding in solder joints is to analyze the assembly process from a materials perspective and from a reflow profiling perspective. Voiding experts from both KIC and Indium Corporation will be on hand to analyze customers’ soldering processes and recommend adjustments to help them to minimize their solder joint voiding.
Customers can drop by the KIC booth anytime between 1-3 p.m. Tuesday and Wednesday, January 29-30. If those times are not convenient, they can email MB Allen at mballen@kicmail.com to make an appointment.
Indium Corporation’s award-winning Indium8.9 No-Clean Pb-free Solder Paste has been proven to avoid the void by reducing voiding to as low as 10 percent. Together with KIC’s reflow profiling systems, customers can reduce overall voiding and improve the reliability of their end product.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.