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KIC and Indium Corporation will hold a voiding clinic in booth #1215 at the IPC APEX EXPO 2019, scheduled to take place January 29-31 at the San Diego Convention Center.
Two of the most effective ways to reduce voiding in solder joints is to analyze the assembly process from a materials perspective and from a reflow profiling perspective. Voiding experts from both KIC and Indium Corporation will be on hand to analyze customers’ soldering processes and recommend adjustments to help them to minimize their solder joint voiding.
Customers can drop by the KIC booth anytime between 1-3 p.m. Tuesday and Wednesday, January 29-30. If those times are not convenient, they can email MB Allen at mballen@kicmail.com to make an appointment.
Indium Corporation’s award-winning Indium8.9 No-Clean Pb-free Solder Paste has been proven to avoid the void by reducing voiding to as low as 10 percent. Together with KIC’s reflow profiling systems, customers can reduce overall voiding and improve the reliability of their end product.
