Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Omega EMS Expands Advanced Inspection Capabilities with New 3D AOI and X-Ray Systems

10/16/2026 | Omega EMS
Investment delivers inline 3D optical inspection across all San Jose SMT production lines and doubles 3D X-ray inspection capacity.

Green Circuits Joins PCBAA to Support U.S. Electronics Manufacturing

10/16/2026 | Green Circuits
Green Circuits, an electronics manufacturing services (EMS) provider serving OEMs across aerospace and defense, medical, industrial, semiconductor and AI hardware markets, has joined the Printed Circuit Board Association of America (PCBAA), strengthening its commitment to supporting a resilient U.S. electronics manufacturing ecosystem and domestic supply chain.

Nordson Test & Inspection Wins 2026 Mexico Technology Award

10/14/2026 | Nordson Test & Inspection
Nordson Test & Inspection, a global leader in inspection, metrology, and testing solutions, announced that its Nordson Sight™ Software Process Control Platform received a 2026 Mexico Technology Award in the Software Process Control category.

U.S AEP Success Rides on Navigating Three Key Market Trends

10/16/2026 | Nolan Johnson, I-Connect007
The U.S. advanced semiconductor packaging strategy is beginning to take a more recognizable shape. Recent developments point to three interconnected trends: advanced packaging is moving closer to traditional electronics assembly, high-bandwidth memory (HBM) packaging is becoming part of U.S. industrial policy, and photonics is emerging as another important layer of heterogeneous integration. These trends could strengthen the U.S. position in the global advanced packaging economy. They also illustrate that much of the underlying supply chain remains incomplete.

KAGA Electronics Signs Contract Manufacturing Agreement with Star seeds for AI Servers

10/13/2026 | KAGA ELECTRONICS
KAGA ELECTRONICS CO., LTD. hereby announces that it has entered into a basic agreement with Star seeds Co., Ltd., an AI infrastructure provider offering end-to-end solutions entirely within Japan, from GPU procurement to AI data center construction and operation.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in