-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Eutect’s First µ-precise Penetration during Thermode Soldering
January 10, 2019 | EUTECTEstimated reading time: 2 minutes
As EUTECT put the first force- and temperature-controlled thermode soldering module into operation at an international headlamp manufacturer in 2005, the measurement of the penetration of the thermode was used exclusively as process monitoring and -control. A lot has happened since then. In 2018, EUTECT completed the next further development of the thermode soldering module, which thanks to freely definable parameters, offers new process opportunities.
"A present-day force- and temperature-controlled thermode soldering module must be able to do more than just monitor a process," said Matthias Fehrenbach, CEO of EUTECT GmbH. Since the completion of the last further development of the particular module, all process-relevant parameters can be defined. "This refers in particular to the contact pressure, penetration depth and the temperature profile, which for the first time can now be defined exactly for the process and the needs of the operator. We thereby offer the user far more than a controlled and monitored process. He gets a 100% coordinated and definable process," elaborated Fehrenbach. These further developments lead to the capability of optimizing the cycle time.
The contact pressure of the thermode is 1-60 N. The contact force is displayed and regulated in steps of 0.5 N. This contact pressure can be input via the new visual controller view, according to application and material. A leading and follow-on hold-down device fixes the surfaces to be soldered. "By means of the application-optimised contact pressure and the hold-down devices, which are also new, we can optimise the cycle time up to 70%, depending on the heat sink of the solder points", stressed Fehrenbach. Furthermore, the penetration can be controlled. The accuracy of the penetration control is about 1µm, which is unique in the field of thermode soldering. "The penetration depth that can be freely adjusted in µ ensures a defined solder gap and therefore the most optimal intermetallic phase formation", as Fehrenbach explained the process advantages.
In addition the temperature profile can also be regulated via the new controller and controlled by means of a redundant temperature measurement. The maximum thermode temperature is 450°C. Resistance measurements for monitoring the contact surfaces are also possible. "Furthermore, we have carried out a few more mechanical adaptations", mentioned Fehrenbach. Through the use of smaller, close-fitting Kapton dispensers, it was possible to minimise the overall installation space. The working stroke can be optionally increased up to 50 mm.
About EUTECT
For over 20 years, at EUTECT soldering and connecting systems have been developed, manufactured, installed and programmed as well as commissioned at customers throughout the world. The team of experts from Swabia offers a comprehensive, continually further developed modular construction kit for process solutions in the field of soldering.
From process modules of the most varied of soldering techniques, the optimal modules with regard to process technology and efficiency are selected for the task and combined to tried and tested stand-alone, rotary transfer or inline production concepts for complete solutions.
The EUTECT modular construction kit shows, that with individual modules or free combinations a lean, individual solution of tried and tested modules can often be achieved for the task of a customer product.
For the optimal solution through evaluation or the series-mature production of A-B-C prototypes, there is a technologically comprehensive and innovative EUTECT technology center available.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.