-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Eutect’s First µ-precise Penetration during Thermode Soldering
January 10, 2019 | EUTECTEstimated reading time: 2 minutes

As EUTECT put the first force- and temperature-controlled thermode soldering module into operation at an international headlamp manufacturer in 2005, the measurement of the penetration of the thermode was used exclusively as process monitoring and -control. A lot has happened since then. In 2018, EUTECT completed the next further development of the thermode soldering module, which thanks to freely definable parameters, offers new process opportunities.
"A present-day force- and temperature-controlled thermode soldering module must be able to do more than just monitor a process," said Matthias Fehrenbach, CEO of EUTECT GmbH. Since the completion of the last further development of the particular module, all process-relevant parameters can be defined. "This refers in particular to the contact pressure, penetration depth and the temperature profile, which for the first time can now be defined exactly for the process and the needs of the operator. We thereby offer the user far more than a controlled and monitored process. He gets a 100% coordinated and definable process," elaborated Fehrenbach. These further developments lead to the capability of optimizing the cycle time.
The contact pressure of the thermode is 1-60 N. The contact force is displayed and regulated in steps of 0.5 N. This contact pressure can be input via the new visual controller view, according to application and material. A leading and follow-on hold-down device fixes the surfaces to be soldered. "By means of the application-optimised contact pressure and the hold-down devices, which are also new, we can optimise the cycle time up to 70%, depending on the heat sink of the solder points", stressed Fehrenbach. Furthermore, the penetration can be controlled. The accuracy of the penetration control is about 1µm, which is unique in the field of thermode soldering. "The penetration depth that can be freely adjusted in µ ensures a defined solder gap and therefore the most optimal intermetallic phase formation", as Fehrenbach explained the process advantages.
In addition the temperature profile can also be regulated via the new controller and controlled by means of a redundant temperature measurement. The maximum thermode temperature is 450°C. Resistance measurements for monitoring the contact surfaces are also possible. "Furthermore, we have carried out a few more mechanical adaptations", mentioned Fehrenbach. Through the use of smaller, close-fitting Kapton dispensers, it was possible to minimise the overall installation space. The working stroke can be optionally increased up to 50 mm.
About EUTECT
For over 20 years, at EUTECT soldering and connecting systems have been developed, manufactured, installed and programmed as well as commissioned at customers throughout the world. The team of experts from Swabia offers a comprehensive, continually further developed modular construction kit for process solutions in the field of soldering.
From process modules of the most varied of soldering techniques, the optimal modules with regard to process technology and efficiency are selected for the task and combined to tried and tested stand-alone, rotary transfer or inline production concepts for complete solutions.
The EUTECT modular construction kit shows, that with individual modules or free combinations a lean, individual solution of tried and tested modules can often be achieved for the task of a customer product.
For the optimal solution through evaluation or the series-mature production of A-B-C prototypes, there is a technologically comprehensive and innovative EUTECT technology center available.
Suggested Items
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.