BAE Systems to Modernize USS Shoup under $78 million contract
January 11, 2019 | BAE SystemsEstimated reading time: 1 minute

BAE Systems has received a $78.8 million contract from the U.S. Navy for the maintenance and modernization of USS Shoup (DDG 86), an Arleigh Burke-class guided-missile destroyer (DDG).
The value of the competitively awarded contract could reach $87.6 million if all options are exercised.
“The Shoup availability is a large, complex repair job,” said David M. Thomas Jr., vice president and general manager of BAE Systems’ San Diego Ship Repair. “Our team is experienced with the DDG class and ready to get to work to ready the Shoup for service in the fleet for many years to come.”
Under the depot maintenance availability contract awarded, BAE Systems will dry-dock the ship, perform underwater hull preservation work, upgrade the ship’s Aegis combat system and its command and control equipment, and rehabilitate crew habitability spaces. The work is expected to begin in March 2019 and be completed in May 2020.
The USS Shoup is the 36th ship in the Arleigh Burke class and was commissioned in June 2002. The ship is named in honor of Medal of Honor recipient and former Commandant of the Marine Corps General David M. Shoup.
About BAE Systems
BAE Systems is a leading provider of ship repair, maintenance, modernization, conversion, and overhaul services for the Navy, other government agencies, and select commercial customers. The company operates four full-service shipyards in California, Florida, Hawaii, and Virginia, and offers a highly skilled, experienced workforce, eight dry-docks/railways, and significant pier space and ship support services.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Elementary, Mr. Watson: High Power: When Physics Becomes Real
10/15/2025 | John Watson -- Column: Elementary, Mr. WatsonHave you ever noticed how high-speed design and signal integrity classes are always packed to standing room only, but just down the hall, the session on power electronics has plenty of empty chairs? It's not just a coincidence; it's a trend I've observed over the years as both an attendee and instructor.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
Bluepath Robotics Optimizes AMR Fleets with Inductive Charging Solution from Wiferion
10/09/2025 | WiferionIn a dynamic and highly competitive industry such as logistics, efficient and uninterrupted material flows are of crucial importance. To ensure maximum uptime for its robots, Bluepath Robotics, which specializes in autonomous mobile robots (AMR), needed a reliable and powerful power supply.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.