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Advanced Electronics Packaging Digest

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Nokia, Lockheed Martin Launch Mission-Critical 5G Solution for U.S. Defense Standards

05/11/2026 | Lockheed Martin
Nokia Federal Solutions and Lockheed Martin announced the launch of a new modular, open‑architecture 5G solution built for the U.S. and allied defense forces.

Imec Launches University Consortium Around Next Generation of Chips

03/13/2026 | Imec
Imec, a world-leading research and innovation hub in advanced semiconductor technologies, has launched a first of its kind consortium with 26 European university groups that will jointly work on the technology roadmap beyond CMOS scaling (CMOS 2.0).

La Luce Cristallina Launches CMOS-Compatible Oxide Pseudo-Substrate

01/27/2026 | PRNewswire
La Luce Cristallina announced it has launched its new CMOS-compatible oxide pseudo-substrate, enabling high-quality, epitaxial strontium titanate (SrTiO₃) films to be grown directly on 200-mm silicon and silicon-on-insulator (SOI) wafers.

Teledyne’s Detectors Successfully Launch Aboard NASA’s BlackCAT CubeSat Mission

01/22/2026 | BUSINESS WIRE
Teledyne Technologies Incorporated, a leading provider of advanced imaging solutions, is proud to announce that its Space Imaging division has successfully deployed its cutting-edge Speedster HyViSI (Hybrid Visible Silicon Imager) Focal Plane Arrays (FPAs) aboard NASA’s BlackCAT CubeSat Mission

PlayNitride to Acquire Lumiode, Accelerating Micro LED Development for Near-Eye Displays

12/22/2025 | TrendForce
PlayNitride Technologies announced that its board approved the acquisition of Lumiode Inc., a U.S.-based company, for US$2 million.
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