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Atotech Presents at NEPCON Japan 2019
January 17, 2019 | AtotechEstimated reading time: 1 minute
Atotech is introducing its latest panel level plating processes and equipment solution for high resolution pattern plating during the NEPCON Japan show, held January 16 to 18, 2019, at Tokyo Big Sight.
Atotech experts are available at booth E25-16, to discuss this and other highlight products, such as their precise chemical processes and manufacturing equipment solutions, which are specifically designed to handle customers current and future needs.
MultiPlate for FOPLP
MultiPlate is Atotech’s revolutionary plating tool which facilitates both, wafer and panel level packaging, in formats up to 650 x 610 mm. While ensuring that plating occurs at the highest current densities and achieving excellent uniformity of the plated structures, its double-sided plating capability enables improved warpage compensation. MultiPlate®’s versatility and multi-functionality helps tackle the current and future challenges for optimal performance in advanced packaging technologies.
MultiPlate Panel - Next generation plating system and Innolyte process family for panel level packaging
Other highlights include:
Novabond EX
NovaBond EX is Atotech’s new and next generation adhesion promoter for advanced package substrates. The horizontal solution provides customers with a unique and reliable process for both inner layer bonding and solder resist materials while providing a smooth interface of < 150nm Ra. The short process operates at low temperatures and short dwell times for higher productivity. NovaBond® EX is compatible with the main materials in use, or planned by, principal OEMs as defined in their future technology roadmaps.
NovaBond EX - Build-up dielectrics and solder resist materials: Excellent and stable performance after thermal stress for a wide range of ABF materials as well as the most common solder resist used in IC substrate manufacturing.
AgPrep
AgPrep is Atotech’s ultimate non-etching adhesion promoter for the lead frame industry. It substantially increases the adhesion of all commonly used molding compounds (EMC) to silver surfaces in semiconductor and LED packages. AgPrep does not create any significant changes to the original performance of the silver surface.
Visitors to the show are invited to stop by Atotech’s booth at E25-16 to learn more about these and many more new solutions for PCB, IC package and advanced packaging applications.
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