The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
Smart Automation: AI—Revolutionizing Inspection in Electronics Manufacturing
Standard of Excellence: The Role of Technology in Enhancing the Customer Experience
PCB Manufacturing and PCB Depaneling Solutions from LPKF
January 18, 2019 | LPKF Laser & ElectronicsEstimated reading time: 1 minute
LPKF Laser & Electronics will be exhibiting at the IPC/APEX Expo in San Diego, California in booth 1651 this year, demonstrating its PCB depaneling and flex PCB drilling laser systems.
LPKF’s flex drilling systems are equipped for high through-put, high-yielding PCB drilling applications, allowing engineers to increase panel yield by an estimated 20% or even save on production steps. Common applications include drilling microvias, clean cutting of cover layer material, efficient and space-saving profiling, and blank cutting with cut edge quality. Engineers increase margins with the new generation of flexible laser machine for more efficient PCB processing. Additionally, laser technology achieves residue-free results that require no post-processing, saving the process step. Further, the number of modules per panel and the packing density can be increased, which reduces the manufacturing cost.
LPKF’s PCB depaneling systems are compact, developed for extremely clean and fast cutting PCB panels and cover layers. It reduces lead times and eliminates tooling costs of layout changes. The substrates are held securely on a vacuum table. This is ideal for depaneling, cutting and engraving a variety of substrates (cover layers, rigid, flex and rigid/flex).
In addition to these systems, LPKF will also be demonstrating its laser plastic welding systems and rapid PCB prototyping technology at the show. For more information on LPKF’s latest laser-based solutions, visit LPKF in booth 1651 at the IPC APEX EXPO 2019.
About LPKF
Established in 1976, LPKF Laser & Electronics manufactures milling and laser systems used in circuit board and microelectronics fabrication, medical technology, and the automotive sector. LPKF’s worldwide headquarters is located in Hannover, Germany and its North American headquarters resides near Portland, Oregon.
Share on:
Suggested Items
Hon Hai Research Institute Partners with Taiwan Academic Research Institute and KAUST to Participate in CLEO 2025
05/30/2025 | FoxconnThe research team of the Semiconductor Division of Hon Hai Research Institute, together with the research teams of National Taiwan University and King Abdullah University of Science and Technology in Saudi Arabia, has successfully made breakthroughs in multi-wavelength μ -LED technology to achieve high-speed visible light communication and optical interconnection between chips.
Meyer Burger Shuts Down Solar Module Production, Lays Off 282 Employees in the U.S.
05/30/2025 | Meyer BurgerMeyer Burger Technology AG is forced to stop its solar module production in the U.S., which is still ramping up, due to a lack of funds. On May 29, 2025, all 282 remaining employees at the Goodyear, Arizona, site received their notices of termination. Production with an annual capacity of 1.4 gigawatts was shut down immediately.
VJ Electronix Appoints Marco Cruz as Mexico Regional Sales Manager
05/30/2025 | VJ ElectronixVJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, is pleased to announce the appointment of Marco Antonio Cruz Tovar as Mexico Regional Sales Manager.
Arrow Electronics Earns Dual Honors as Dell Technologies Partner of the Year
05/29/2025 | BUSINESS WIREGlobal technology solutions provider Arrow Electronics has received two prestigious awards from Dell Technologies: 2025 OEM Solutions Partner of the Year and 2025 North America Distributor of the Year. The awards were announced at Dell Technologies World, held in Las Vegas in late May.
Imec Unveils Record-Low Loss 300mm RF Silicon Interposer for Sub-THz Systems
05/27/2025 | ImecAt the IEEE ECTC 2025 conference, imec – a world-leading research and innovation hub in nanoelectronics and digital technologies – highlights the exceptional performance and flexibility of its 300mm RF silicon interposer platform.