Standard of Excellence: Anticipating Customer Needs Early and Often
The Knowledge Base: At the Forefront of Electronics Manufacturing
Global Citizenship: Training the Next Generation of Talent
iNEMI Solder Materials Workshop at IPC APEX EXPO 2019
January 21, 2019 | iNEMIEstimated reading time: 1 minute
iNEMI will be holding a free workshop next week at IPC APEX EXPO 2019, that will focus on the future of solder materials and how these materials must advance to meet the needs of new products and processes.
This interactive workshop will feature speakers, panel sessions and working groups focused on user needs and materials development.
Keynote speakers include Dr. Carl Bilgrien, Vice President of Innovation at Alpha Assembly Solutions, who will speak on “Technology Roadmap to Meet Next-Generation Assembly Challenges”. Ashay Dani, Director, Materials Technology Development, Assembly Technology Development, at Intel Corp., meanwhile, will speak on "Advanced Packaging Materials – Challenges and Opportunities."
The free workshop will be held on January 31, 2019, from 8:00 a.m. to 2:00 p.m.
Additional speakers include presenters from Indium, HP, Dell, Raytheon, Flex and John Deere. There will also be Q&A panels focused on application-driven materials needs and the challenges of new materials for high-volume assembly.
Registration
This workshop is one of the IPC APEX Buzz Sessions. If you don’t register to attend anything else at IPC APEX, you will need an exhibit hall registration to access this workshop. This is available for free via online registration until Saturday, January 26. After January 26, there is a $40 fee for both online and onsite registration. Click here for IPC registration packages.
For further details, please contact Grace O'Malley at grace.omalley@inemi.org.
Share on:
Suggested Items
KYZEN to Highlight Stencil and Cleaning Solutions at SMTA Monterrey
03/27/2025 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, April 10 at the Cintermex Convention Center in Monterrey, Nuevo León. KYZEN cleaning experts will be on-site highlighting stencil cleaning chemistries KYZEN E5631J and CYBERSOLV C8882.
Indium to Showcase Proven EV Products and High-Reliability Alloys at Productronica China
03/26/2025 | Indium CorporationAs a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 26-28, in Shanghai, China.
SolderKing Enhances Brainboxes' Electronics Manufacturing with Expert Support and Advanced Materials
03/26/2025 | SolderKingIn modern electronics manufacturing, success relies on more than high-quality soldering materials. Technical knowledge and process expertise are just as crucial for achieving consistent results. SolderKing, a leading UK manufacturer, provides both, combining advanced consumables with specialist support to help manufacturers optimise their soldering processes.
AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Monterrey Expo & Tech Forum
03/20/2025 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Monterrey Expo & Tech Forum taking place on April 10 at Cintermex in Monterrey, Nuevo Leon, Mexico.
Hentec Industries/RPS Automation to Showcase Valence 2508 at IPC Expo 2025
03/17/2025 | Hentec Industries/RPS AutomationThe Valence 2508 Selective Soldering System is engineered for high-mix, high-volume, advanced PCB production. It supports boards ranging from 25 x 25 mm to 559 x 559 mm (1 x 1 in. to 22 x 22 in.), with a maximum processing area of 508 x 508 mm (20 x 20 in.).