The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
iNEMI Solder Materials Workshop at IPC APEX EXPO 2019
January 21, 2019 | iNEMIEstimated reading time: 1 minute
iNEMI will be holding a free workshop next week at IPC APEX EXPO 2019, that will focus on the future of solder materials and how these materials must advance to meet the needs of new products and processes.
This interactive workshop will feature speakers, panel sessions and working groups focused on user needs and materials development.
Keynote speakers include Dr. Carl Bilgrien, Vice President of Innovation at Alpha Assembly Solutions, who will speak on “Technology Roadmap to Meet Next-Generation Assembly Challenges”. Ashay Dani, Director, Materials Technology Development, Assembly Technology Development, at Intel Corp., meanwhile, will speak on "Advanced Packaging Materials – Challenges and Opportunities."
The free workshop will be held on January 31, 2019, from 8:00 a.m. to 2:00 p.m.
Additional speakers include presenters from Indium, HP, Dell, Raytheon, Flex and John Deere. There will also be Q&A panels focused on application-driven materials needs and the challenges of new materials for high-volume assembly.
Registration
This workshop is one of the IPC APEX Buzz Sessions. If you don’t register to attend anything else at IPC APEX, you will need an exhibit hall registration to access this workshop. This is available for free via online registration until Saturday, January 26. After January 26, there is a $40 fee for both online and onsite registration. Click here for IPC registration packages.
For further details, please contact Grace O'Malley at grace.omalley@inemi.org.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.