Powering the Future: The Materials That Make Tomorrow Possible
Global Sourcing Spotlight: Supplier Audits—Ensuring Compliance in Global Sourcing
Nolan’s Notes: Welcome to a Strong 2026!
iNEMI Solder Materials Workshop at IPC APEX EXPO 2019
January 21, 2019 | iNEMIEstimated reading time: 1 minute
iNEMI will be holding a free workshop next week at IPC APEX EXPO 2019, that will focus on the future of solder materials and how these materials must advance to meet the needs of new products and processes.
This interactive workshop will feature speakers, panel sessions and working groups focused on user needs and materials development.
Keynote speakers include Dr. Carl Bilgrien, Vice President of Innovation at Alpha Assembly Solutions, who will speak on “Technology Roadmap to Meet Next-Generation Assembly Challenges”. Ashay Dani, Director, Materials Technology Development, Assembly Technology Development, at Intel Corp., meanwhile, will speak on "Advanced Packaging Materials – Challenges and Opportunities."
The free workshop will be held on January 31, 2019, from 8:00 a.m. to 2:00 p.m.
Additional speakers include presenters from Indium, HP, Dell, Raytheon, Flex and John Deere. There will also be Q&A panels focused on application-driven materials needs and the challenges of new materials for high-volume assembly.
Registration
This workshop is one of the IPC APEX Buzz Sessions. If you don’t register to attend anything else at IPC APEX, you will need an exhibit hall registration to access this workshop. This is available for free via online registration until Saturday, January 26. After January 26, there is a $40 fee for both online and onsite registration. Click here for IPC registration packages.
For further details, please contact Grace O'Malley at grace.omalley@inemi.org.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
P. Kay Metal Expand Presence in El Salvador with New MS2 Molten Solder Surfactant Installations
01/12/2026 | P. Kay Metal, Inc.MS2 Technologies, LLC/ P. Kay Metal, continues to strengthen its presence in Central America through the successful installation of MS2® Molten Solder Surfactant systems at electronics manufacturing facilities throughout El Salvador.
Implementing Inkjet Solder Mask: A Customer Success Story
01/13/2026 | Paola Dinelli, KLAOne of the most significant advancements in PCB manufacturing in recent years has been the shift from traditional solder mask processes to digital inkjet technology. This transition offers clear benefits in performance, usability, and production efficiency. This article presents a case study of a PCB manufacturer that successfully implemented inkjet technology for solder mask application, realizing significant gains in quality, cost savings, and yield by overcoming the limitations of traditional methods.
Solderking Achieves Internationally Recognised Environmental Management Standard
01/12/2026 | SolderKingSolderKing Assembly Materials Ltd. has achieved certification to ISO 14001:2015, strengthening its approach to environmental management across its UK manufacturing operations.
Nordson SELECT System Boosts Kamstrup Output by 20%
01/09/2026 | Nordson SELECTNordson Electronics Solutions announced that Kamstrup has increased production throughput 20% and reclaimed 6 meters (19.7 feet) of factory floor space by upgrading its through‑hole technology (THT) production line with the Nordson SELECT Synchro selective soldering system.
IPC Hand Soldering Competition 2026 UK Regional Qualification Opens Registration
01/05/2026 | Global Electronics AssociationThe IPC Hand Soldering Competition (HSC) 2026 UK Regional Qualification will take place from 3–5 February 2026 at the Farnborough International Exhibition Centre, bringing together top electronics manufacturing professionals to showcase their precision soldering skills.