Rogers Offers Efficient Cooling Solutions at SPIE Photonics West 2019
January 22, 2019 | Rogers CorporationEstimated reading time: 3 minutes
Rogers Corporation’s Power Electronics Solutions (PES) group will once again contribute as a major exhibitor to one of the world’s largest events for photonic products and technologies: the upcoming SPIE Photonics West Conference and Exhibition. The conference and exhibition is scheduled for February 2nd through February 7, 2019 in San Francisco’s Moscone Center.
Photonics West is the world’s largest multidisciplinary gathering for lasers, photonics, and biomedical optics products and technologies, with more than 20,000 visitors expected to attend the week-long 2019 event. Photonics West includes a scientific conference with more than 4500 technical presentations in three topic areas (biomedical optics and biophotonics, laser sources and lasers, and optoelectronic materials and devices). It also features two exhibitions: the BiOS Expo, with 200 companies showing products and services on biomedical optics, and the SPIE Photonics West 2019 Exhibition, where attendees can visit representatives from more than 1300 global suppliers of lasers and photonics. Among those, Rogers PES will be showing their innovative material solutions for enhancing the performance of lasers and photonics components and systems.
Rogers at Booth 4235
Representatives from Rogers PES group (Rogers Germany GmbH) will be a part of the SPIE Photonics West 2019 Exhibition, available at booth 4235 to show samples of their latest material-based products and to offer advice on how to apply those products to lasers and photonics designs for effective thermal management and extended operating lifetimes. Among the many Rogers PES products on display at booth 4235 will be its curamik families of cooling products, such as curamik CoolPerformance Plus. This active water-cooled laser diode cooler effectively removes the heat from high-power laser diodes in the tightest spaces, helping to enhance power efficiency and extend operating lifetimes. These curamik CoolPerformance Plus coolers are formed from OFHC copper for excellent thermal conductivity and ceramic substrate for high isolation, combining for a tightly controlled coefficient of thermal expansion (CTE) of 6.5 to 7 ppm/K from +25 to +300°C.
In addition to curamik CoolPerformance Plus, Rogers PES will show examples of its curamik CoolPower and curamik CoolEasy material-based laser and photonics cooling solutions. The curamik CoolPower and CoolPower Plus coolers are fabricated with multiple layers of pure copper for effective thermal dissipation in the smallest volumes possible. The coolers benefit from the unique curamik bonding process to achieve hermetic multilayer structures without solder or additional adhesive layers. The curamik CoolEasy coolers are especially designed for conductive cooling of high-power laser diodes and laser diode bars. These copper coolers can be precisely machined and milled to meet the flatness requirements for mounting to laser diodes and avoiding potential “hotspots” in laser diode circuits.
Become a Member of the Design Support Hub
Rogers PES brings its more than 40 years of experience together in a handy online resource that is available 24/7. The PES Design Support Hub features complete technical information on ROLINX busbars, capacitor busbar assemblies and curamik ceramic substrates, a library of technical papers on product design and problem solving and helpful videos on products and power distribution topics. Registration for access is quick and free of charge. The Design Support Hub helps design engineers to increase power, manage heat, and ensure the quality and reliability of their devices for optimal new product design.
About Rogers Corporation
Rogers Corporation is a global leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, internet connectivity, and safety and protection applications, as well as other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification and alternative energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.