-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Innovative Korean Company on Top at Altus
January 23, 2019 | Altus GroupEstimated reading time: 2 minutes

Leading 3D measurement-based inspection equipment provider, Koh Young, reported impressive growth in 2018 with new facilities, technology and the placement of its 13,000th inspection system installed in Germany. This success has filtered through to Altus, a leading distributor of the Korean company’s capital equipment in the UK and Ireland.
Koh Young’s impressive milestone of installing its 13,000th inspection system, Zenith 2 AOI, and its growth last year reflects that of Altus. Andrew Wolfe, Altus’ Sales Support Manager explains; “Koh Young had a very successful year with their range of equipment and Altus also shared in this as we received unprecedented enquiries for the products.
“Last year Altus supplied 30 Koh Young systems bringing our installed base to an impressive 140 AOI and SPI systems in total. Koh Young Zenith 3D AOI has really caught people’s imagination due to its extraordinary technological ability and innovative software. Based on their technology ‘Zenith’, it measures the true profilometric shape of components, solder joints, patterns and even foreign material on assembled PCBs with patented 3-dimensional measurement, overcoming the shortcomings and vulnerabilities of traditional 2D AOI.
“Koh Young has incorporated KSMART software into the Zenith system. This software incorporates an ‘Intelligent Platform’ ensuring the highest level of connectivity for all the inspection stations, enhancing overall automation capability. It is innovations like this that are making Koh Young stand out and helping to achieve impressive sales results.”
The KSMART Solution is entirely modular and offers maximum production efficiency and control for advanced electronics manufacturing. With miniaturisation on the increase, and more complex products being designed, flexibility and increased standards for equipment that must communicate in real time are important. KSMART comprises an easy-to-use toolbox designed to meet these challenges. It enables real-time analysis of defects, beginning with simply providing true 3D inspection data obtained from Koh Young's 3D inspection systems. This data is essential for finding root causes of defects and achieving process optimisation.
About Altus Group Ltd
Altus Group was formed in 2001 to support the UK and Irish market for Surface Mount Technology, capital equipment for every process, peripheral equipment, spares and consumables and most importantly excellent service support.
The Altus Group product line has evolved over the years with carefully selected suppliers who offer ‘best in class’ products at cost effective prices, from world leading brands.
The Altus Team has a network of highly skilled technical sales specialists, applications and service engineers, providing local support across the UK and Ireland.
In 2005 sister company Danutek was formed with offices in Hungary and Romania to service the needs of local customers and multi-national companies with manufacturing facilities in the Central and Eastern European marketplace.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.