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Advanced Electronics Packaging Digest

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FSQuality in Thailand: From Automotive and Industrial Controls to AI and Optical Modules

11/05/2026 | Tulip Gu, ECIO and Marcy LaRont, I-Connect007
One year after their first visit, the ECIO team returned to FSQuality Co., Ltd.’s Thailand factory to see what had changed over an eventful 12 months. The team was joined by Marcy LaRont following the THECA 2026 event in Bangkok. Having met with FSQuality Chairman Liu Tianming at the show the week before, we were eager to see firsthand how the company has evolved its customer strategy, expanded manufacturing to support AI and optical module applications, and added another new building to further increase its high-end manufacturing capabilities and strengthen Thailand’s growing PCB value chain.

TECO, Foxconn Showcase NVIDIA-Based Modular Data Center

11/02/2026 | Foxconn
Teco Electric participated in Foxconn Technology Day for the second time, focusing on its Modular Data Center (MDC ) concept developed in cooperation with Foxconn. The MDC is based on the NVIDIA DSX POD reference design.

Murata to Expand Production Capacity of Multilayer Ceramic Capacitors Going Forward

10/30/2026 | Murata
Murata Manufacturing Co., Ltd. (Murata) will expand its global production capacity of multilayer ceramic capacitors (MLCCs) by 2030 to meet medium- to long-term demand growth.

Technica USA to Attend SEMICON West 2027, Expanding Presence in the Semiconductor Market

10/26/2026 | Technica USA
Technica USA recently attended the SEMICON West Expo, where company representatives Jason Perry, President; Peter Chen, Equipment Service Manager; and Frank Medina focused on strengthening relationships with customers and supply partners while preparing for the company’s participation in SEMICON West 2027 that will take place March 30-April 1, in Phoenix, Arizona.

Trouble in Your Tank: Are PCB Fabricators Ready for the Next Technology Curve?

10/26/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry’s demand for smaller, faster, and more powerful devices is driving major advances in PCB manufacturing. One of the central priorities is to increase circuit density while maintaining performance and reliability. Manufacturers produce finer lines and spaces so more components can fit on smaller, more sophisticated boards. They are also refining SMT features to support tighter pitches without compromising performance.
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