Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Rehm Exhibited at SMTA in Mexico
January 25, 2019 | Rehm Thermal SystemsEstimated reading time: 1 minute
A successful conference with good organization and many interested customers: that was the SMTA 2018 in Guadalajara, Mexico. Rehm Thermal Systems presented itself with the condensation soldering machine CondensoXC, attracting many visitors to the stand.
Being close to the customer—around the globe: This is one of the principles of Rehm Thermal Systems. Also at the SMTA in Guadalajara (Mexico) in the middle of November, the specialist for thermal system solutions from Blaubeuren presented itself with one of its systems: the space-saving, yet powerful CondensoXC condensation soldering machine, which is particularly suitable for laboratory applications, small series production or prototyping.
"Mexico is an important market for us, in which almost all well-known automobile manufacturers and their suppliers are represented. Our soldering systems are well received in this and many other industries”, said Luis Garcia, branch manager of Rehm Mexico. SMTA Guadalajara was organized by the Surface Mount Technology Association, which has existed since 1984.
And the next event for Rehm Thermal Systems in Mexico is already on the agenda: On February 13th and 14th, a two-day seminar on reflow soldering, temperature profiling, soldering defects and defect management will take place at the Rehm Technology Center in Guadalajara.
About Rehm Thermal Systems
As a specialist in thermal system solutions for the electronics and photovoltaics industry, Rehm is a technology and innovation leader in state-of-the-art, cost-effective manufacturing of electronic assemblies. We are a globally active manufacturer of reflow soldering systems with convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for the metallisation of solar cells as well as numerous customised systems. We have a presence in all key growth markets and, with more than 25 years of industry experience, we are able to implement innovative production solutions that set new standards.
Share on:
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.