Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Scienscope to Display Three New Systems at IPC APEX EXPO 2019
January 28, 2019 | Scienscope InternationalEstimated reading time: 2 minutes
Scienscope International will display three new systems in booth #441 at the 2019 IPC APEX EXPO, scheduled to take place January 29-31, 2019 at the San Diego Convention Center. To further establish the company as the leader in automated X-ray component counting, Scienscope will debut the AXC-800 II component counter that features automatic internal bar code scanning to eliminate the use of an external bar code reader.
Also on display will be two systems that take a novel approach to the realities of component counting and inventory management – the AXC-800 7" and the automated AXI-5100 7". The systems specifically address the reality that 7" reels are by far the dominant category of SMT inventory, and are designed to address that fact by being dedicated to what is counted most often – 7" reels. The new systems will help define the component counting category by offering the lowest cost available for companies to begin accurate component counting.
“System automation and the reduction of manual steps for operators are key goals as we look towards the factories of the future,” stated Don Jeka, National Sales and Marketing Manager. “Scienscope has aligned our product development to continue to focus on these goals. We are proud of our steps forward in this area, and we look forward to attendees at the IPC APEX EXPO seeing the new AXC-800 II and our AXI-5100C II series on display in booth 441, both offering the highest levels of automation available in their market segment. With the addition of our 7" series systems, Scienscope offers the best value to price point component counting available in the industry. Inventory control and management, which includes accurate component counting, are absolutely critical elements as we look towards the modernization of material handling in our industry.”
Scienscope also will have its well-established line of microscopes, video measurement and metrology systems on display in the booth at the 2019 IPC APEX EXPO.
About Scienscope International
Scienscope was founded in 1994 to meet the growing need for reliable and affordable general-purpose optical and video inspection solutions for the electronics and PCB industries. The company began with basic stereo zoom microscopes used for SMT inspection and rework of circuit boards and electromechanical assemblies with a commitment to quality, value and support. Over the past 25 years, Scienscope has evolved to become a complete inspection solution provider, offering both offline and inline X-Ray systems, Video coordinate measurement systems, Video inspection systems, and microscopes to meet a wide variety of applications and manufacturing quality requirements.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.