-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Leo Lambert Inducted into IPC Hall of Fame
January 30, 2019 | EPTAC CorporationEstimated reading time: 2 minutes
Leo Lambert, vice president and technical director at EPTAC Corporation has been given the highest IPC Honor, The Raymond E. Prichard Hall of Fame Award for his extraordinary contributions to the electronics industry and the IPC. Leo received this award and induction during the IPC APEX EXPO 2019 in San Diego during which Leo’s longstanding achievements were spotlighted.
Leo Lambert has been the vice president and technical director at EPTAC Corporation for over two decades, but a consummate contributor to the electronics industry and the IPC for much longer than that. His involvement with the IPC stems back to 1976, where Leo first engaged the committee’s efforts was under Harris Electronics and later in his career, Digital Equipment Corporation, known as DEC for many years prior to EPTAC.
Through these efforts, Leo has been an engaged contributor, chair and co-chair of numerous committees and task groups through-out the years and continues to serve in these rolls to this day. As a participant in the Technical Activities Executive Committee (TAEC) and active contributor to IPC J-STD-001 and Handbook, IPC-A-610 and IPC-AJ-820 Handbooks, IPC-A-600, IPC-6012 and IPC/WHMA-A-620, Leo has continued to support industry efforts to develop best practices and advocate excellence in electronics manufacturing.
Leo continues to be a champion, supporter and yes, sometimes zealot for the promotion of the industries adoption of standards and their development to date. In addition, his efforts spilled over into the certification process, supporting these programs and nurturing them to where they are today.
“Leo’s accomplishments and awards are too numerous to mention in a release, but they only scratch the surface of the man we at EPTAC know”, comments Mark Pilkington, President and CEO of EPTAC Corporation. “It is an honor to work with someone with endless patience, a willingness to educate and guide everyone he comes into contact with and a selfless unjudging commitment to support not only everyone at EPTAC, but our client base as well. On a personal note, we are proud of his achievements, humbled to call him a friend and honored to play a small part of his journey for decades, whereas many have only experienced his presence briefly.”
EPTAC, the most internationally recognized leader in solder training and IPC certification, gives professionals the skills to accelerate their careers and businesses the talent to succeed in this ever-competitive industry. For over 30 years, EPTAC has been helping companies increase quality standards, improve productivity and maximize profits. Headquartered in Manchester, NH, EPTAC delivers the industry best training programs throughout established locations in the United States and Canada.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.