Semiconductor for Making Thin-Film Transistors
January 31, 2019 | Dongguk UniversityEstimated reading time: 2 minutes

Scientists at Dongguk University have found a way to create printed p-channel thin-film transistors by using the abundantly available and environmentally friendly copper(I) iodide semiconductor at room temperature. Their energy-efficient and cost-effective fabrication method for these transistors may pave the way for developing low-cost and novel optoelectronic devices.
Transistors are the building blocks of most of the electronic devices we use every day, and research on fabricating new types of semiconducting materials for thin-film transistors (TFIs) has been ongoing for decades. Whenever new transistors or novel fabrication methods are discovered, many previously impossible applications become feasible, such as ultrahigh-definition transparent displays and flexible electronic devices. Nowadays, there is a huge demand for p-type transparent semiconductors (which are conductive due to the movement of charge carriers called “holes”) for making p-channel transistors, but when compared to the n-type counterparts, their use is limited by chemical instability and poor electric properties.
To overcome these limitations, a research team at Dongguk University led by Prof. Yong-Young Noh focused on developing a p-type transparent semiconductor for TFTs using a metal halide like copper(I) iodide (CuI), instead of metal oxide. “The naturally abundant and environment friendly constitutional elements of CuI make it more appropriate for large-scale printed transparent electronics. More importantly, CuI has a higher hole mobility than other p-type oxide-based semiconductors,” explains Prof. Noh.
However, CuI had been barely used as a semiconductor for TFTs because its hole concentration is so high that it results in uncontrollable conductivity (transistors are generally meant to be easily turned on and off at high speeds, that is, they are meant to be switchable from a conductive to a non-conductive state). Moreover, standard solution-based processing for making thin films generally requires a heat treatment called “annealing,” which is energy and time consuming.
The researchers found out that it is possible to reduce the conductivity of CuI-based thin films by making them even thinner and thus suitable for fabricating TFTs with the performance that is currently in demand for many applications. Additionally, these CuI thin films do not require annealing at all and can be processed at room temperature. This saves energy and makes them more cost-effective.
The team tested multiple processing conditions and fabricated various different TFTs to determine the origin of the enhanced device properties and to demonstrate the potential uses of CuI as a thin-film p-type semiconductor. “We believe that this work opens the floodgate for room-temperature, low-cost, printed transparent p-type transistors for diverse optoelectronic devices,” concludes Prof. Noh.
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.