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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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The Test Connection Inc. to Showcase Electronic Test Solutions at SMTA Guadalajara 2026

09/08/2026 | The Test Connection Inc.
TTCI will exhibit as part of the USM Reps booth 910, connecting with electronics manufacturing professionals from across Mexico and the international electronics industry.

Zuken Launches E3.series 2027 With Expanded Engineering and Manufacturing Capabilities

09/08/2026 | Zuken
Zuken announced E3.series 2027, the latest release of its electrical design software for wiring, wire harness, fluid, and control systems design.

Indium Promotes Hongwen Zhang to Research and Development Director

09/04/2026 | Indium Corporation
Indium Corporation has promoted Hongwen Zhang, Ph.D., to Research and Development (R&D) Director. In this role, he will lead technology development, product road-mapping, and the continued advancement of the company’s materials portfolio.

TTCI Brings Manufacturing Test Expertise to Keysight UGM in Santa Clara

09/03/2026 | TTCI
The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, is pleased to announce that it will exhibit at the Keysight Technologies Manufacturing Test User Group Meeting (UGM) on September 16, 2026, in Santa Clara, California.

Battalion Advanced Technology, Penn State Launch National Security Research Collaboration

09/02/2026 | PRNewswire
Penn State and Battalion Advanced Technology Ltd, have entered into two research agreements worth up to $6 million to develop advanced semiconductor platforms and high temperature materials that aim to enable next generation energy, transportation, aerospace and industrial systems while also providing critical capabilities for national security.
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