Combining New Solar Cell Technology With Dynamic Glass
February 4, 2019 | Uppsala UniversityEstimated reading time: 1 minute

A collaboration will investigate if newly patented high-transparency solar cells from the startup company Peafowl Solar Power can power dynamic glass from ChromoGenics. Both companies derive from research at the Ångström Laboratory at Uppsala University.
During 2019 Nasdaq-traded ChromoGenics will test powering their dynamic glass with newly developed high-transparency solar cells. The patented cells have been developed by Peafowl Solar Power, an innovative cleantech-startup founded in Uppsala in 2018. Dynamic glass controls transmission of heat and light and can save up to 50% on cooling and heating costs. Combining the dynamic glass window with a transparent solar cell would eliminate the need for an external power source and thus reduce installation costs significantly and increase flexibility of placement.
"It is a great opportunity for us to work with a company like ChromoGenics that has hands-on experience of scaling up from research to industrial manufacturing. We are very eager to see how our cell performs when powering a real application in real-life conditions," says university researcher Jacinto Sá, who's also founder and CEO of Peafowl Solar Power.
The cell developed by Peafowl Solar Power can be combined with different materials and made to any degree of transparency or color.
"There are several semi-transparent solar cells on the market, but before now none of them have lived up to the high transparency requirements of our dynamic glass. We look forward to investigating the possibilities of combining our two technologies into a unique product with great market potential," says Greger Gregard, co-founder and CTO of ChromoGenics.
Sara Gredemark
Suggested Items
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
Airbus-built MetOp-SG Weather and Climate Satellite Shipped to Kourou
06/06/2025 | AirbusReady for launch - the first of the Airbus-built MetOp-SG weather and climate monitoring satellites left Toulouse cleanrooms a few days ago and is now en-route for Kourou, French Guiana onboard the “Canopée” transport ship.
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
New TSN-MACsec IP Core for Secure Data Transmission in 5G/6G Communication Networks
04/15/2025 | FraunhoferReliability and security in broadband communication networks (5G/6G) are crucial for meeting the challenges of the digital future. Together with aconnic AG, Fraunhofer IPMS has developed an innovative IP core as part of the “RealSec5G” project, which combines the advantages of a MACsec IP core with those of a Time-Sensitive Networking (TSN) IP core.
AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Capital Expo & Tech Forum
04/11/2025 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Capital Expo & Tech Forum taking place on May 8 at George Mason University – Mason Square in Arlington, Virginia.