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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Fujitsu Develops Diamond-spin Quantum Computer Prototype

09/08/2026 | JCN Newswire
Fujitsu announced that it has developed the world’s first working prototype of a diamond-spin quantum computer incorporating tin-vacancy (SnV) centers into photonic integrated circuits.

Fuji Launches the Auto Kitting Station

06/12/2026 | Fuji Corporation
Fuji Corporation has developed a new unit, the Auto Kitting Station, which automates the tape reel loading process (kitting process) for feeders used to supply electronic components to machines; a process that has traditionally been difficult to automate and heavily dependent on manual labor.

Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing

06/11/2025 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd

Airbus-built MetOp-SG Weather and Climate Satellite Shipped to Kourou

06/06/2025 | Airbus
Ready for launch - the first of the Airbus-built MetOp-SG weather and climate monitoring satellites left Toulouse cleanrooms a few days ago and is now en-route for Kourou, French Guiana onboard the “Canopée” transport ship.

Indium Wins EM Asia Innovation Award

05/01/2025 | Indium Corporation
Indium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
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