Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
Marcy’s Musings: Can You Hear the Voices?
The Marketing Minute: Strategic Short-form Content Builds Brand Momentum
Henkel Expands BERGQUIST GAP PAD Portfolio
February 4, 2019 | HenkelEstimated reading time: Less than a minute
Henkel Corporation has announced the addition of two ultra-low modulus BERGQUIST GAP PAD thermal interface materials (TIMs) to its award-winning line of high compliance thermal management products. BERGQUIST GAP PAD TGP 6000ULM and BERGQUIST GAP PAD TGP 7000ULM have been formulated with an advanced resin platform to deliver ultra-low modulus capabilities and high thermal conductivity of 6.0 W/m-K and 7.0 W/m-K, respectively.
“As densities increase with electronics miniaturization, maximizing heat dissipation while minimizing assembly stress on delicate components is challenging but essential for reliability,” says Danny Leong, Henkel Global Technology Manager, Thermal Products. “Our new ultra-low modulus TIMs provide this unique performance combination in custom-sized pads with easy handling to enhance process efficiency.”
BERGQUIST GAP PAD TGP 6000ULM and BERGQUIST GAP PAD TGP 7000ULM are very soft pads with high conformability to rough or irregular surfaces, effectively filling intricate gaps and allowing for thorough wet out at the interface for maximum thermal transfer. Historically, marrying ultra-low modulus (Shore 000, ASTM D2240) properties with high thermal conductivity has been challenging at best. However, due to the advanced silicone-based resin formulation and filler package, the new BERGQUIST GAP PADs provide exceptionally low assembly stress alongside high thermal control.
Share on:
Suggested Items
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.
Bridging the Gap Between PCB Designers and Fabricators
04/03/2025 | Stephen V. Chavez, Siemens EDAWith today’s advanced EDA tools, designing complex PCBs in the virtual world does not necessarily mean they can be built in the real world. This makes the relationship between a PCB designer and a fabricator pivotal to the success of a project. In keeping with solid design for manufacturing (DFM) practices, clear and frequent communication is needed to dial and lock in design constraints that meet expectations while addressing manufacturing concerns.
Hitachi Announces Completion of New Production Facility for Semiconductor Manufacturing Equipment
04/01/2025 | JCN NewswireHitachi High-Tech Corporation announced that the new production facility for semiconductormanufacturing equipment (etch systems), which had been under construction since December 2023 in the Kasado area (Kudamatsu City, Yamaguchi Prefecture), was completed and started the operation on March 17, 2025.
Paige Fiet: From Emerging Engineer to Quality at TTM
03/19/2025 | Marcy LaRont, PCB007 MagazinePaige Fiet is a graduate of the IPC Emerging Engineer program and now works at TTM Technologies in Logan, Utah. She was an IPC Student Board Member and has been a columnist for I-Connect007. She is a stellar example and an encouragement to other young engineers about how to be successful in your early career.
IPC APEX EXPO 2025: And So It Begins
03/18/2025 | Nolan Johnson, I-Connect007The IPC APEX EXPO 2025 show floor opens today, but technical, educational, and, of course, standards committee work has been underway during the preceding weekend. In typical spring fashion, the weather has vacillated between sunny and warm to a spot of rain late on Monday afternoon just as many conference goers were headed back to their nearby hotels.