-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young Celebrates a Successful IPC APEX EXPO 2019
February 6, 2019 | Koh Young AmericaEstimated reading time: 3 minutes
Not even the polar vortex could stop Koh Young America from having a highly successful IPC APEX EXPO in San Diego during the last week of January 2019.
“Despite the weather in the Midwest and New England, Koh Young America is very pleased with the outcome from the IPC APEX EXPO,” said Juan Arango, Managing Director at Koh Young America.
During the show, Koh Young America earned a pair of new product introduction (NPI) awards. In the category of Process Control Software, it received an award for the Koh Young Process Optimizer (KPO). In the category Test & Inspection for SPI (Solder Paste Inspection), Koh Young won the award for its Auto Repair function, an option for its industry-leading SPI systems.
Award-winning Auto Repair SPI Function
Koh Young Auto helps manufacturers improve quality and productivity by integrating an automated paste dispenser into its 3D SPI systems. Combining an SPI and a dispenser helps prevent insufficient solder, so manufacturers can reduce costs by eliminating board scrap or rework.
“When our SPI is configured with the Auto Repair feature, manufactures enhance first pass yield and reduce operational costs,” said Joel Scutchfield, Koh Young America Sales Director. “The 3D SPI becomes more than an inspection system, it becomes a process optimizer.”
Award-winning Koh Young Process Optimizer (KPO)
Beyond hardware solutions, the company was also recognized for the Koh Young Process Optimizer (KPO). KPO includes a set of software modules that exercise complex algorithms to develop and implement closed-loop print process improvements through machine-to-machine (M2M) connectivity.
“Product miniaturization is driving smaller aperture designs and finer solders, which makes printing a highly-sophisticated process with significant impact on yields. Manufacturers must constantly develop and apply optimal printing parameters during production,” said Ray Welch, Project Manager at Koh Young America. “With so many print process variables, it takes real expertise to correctly define the ideal parameters. Using KPO will help automate the process with continual monitoring and adjustment.”
The Smart Factory Demonstrated
Koh Young has been driving toward the smart factory for years and we showed our resolve in several ways at APEX.
“Not only did Koh Young proudly participate in the IPC Connected Factory Exchange (CFX) and Hermes demo lines, we highlighted numerous ways we can convert our true 3D measurement data into actionable information,” said Brent Fischthal, Sr. Marketing Manager at Koh Young America and an IPC CFX Committee member. “Complementing the CFX and Hermes standards, Koh Young KSMART uses the latest artificial intelligence technology to help manufacturers realize a smart factory.”
Throughout the show, Koh Young presented how its new AI Platform intelligently applies real-time data to improve the production process. Koh Young integrated additional solutions in several of the demo lines at some of our partners, which included ITW EAE, Panasonic Factory Solutions, Fuji America, Cogiscan, and Eunil.
As IPC APEX EXPO concludes, we now turn to NEPCON China, where Koh Young will highlight its latest innovations for the inspection market, including new hardware and software solutions that drive production and process improvements. We welcome show attendees to visit us in the Surface Mount Technology Pavilion at the Shanghai World Expo Center during 24-26 April 2019.
About Koh Young Technology Inc.
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, China, Mexico, and the United States. These local facilities ensure it sustains a close relationship with its growing customer base, while providing them with access to a global network of inspection and measurement experts.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.