-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Koh Young Celebrates a Successful IPC APEX EXPO 2019
February 6, 2019 | Koh Young AmericaEstimated reading time: 3 minutes
Not even the polar vortex could stop Koh Young America from having a highly successful IPC APEX EXPO in San Diego during the last week of January 2019.
“Despite the weather in the Midwest and New England, Koh Young America is very pleased with the outcome from the IPC APEX EXPO,” said Juan Arango, Managing Director at Koh Young America.
During the show, Koh Young America earned a pair of new product introduction (NPI) awards. In the category of Process Control Software, it received an award for the Koh Young Process Optimizer (KPO). In the category Test & Inspection for SPI (Solder Paste Inspection), Koh Young won the award for its Auto Repair function, an option for its industry-leading SPI systems.
Award-winning Auto Repair SPI Function
Koh Young Auto helps manufacturers improve quality and productivity by integrating an automated paste dispenser into its 3D SPI systems. Combining an SPI and a dispenser helps prevent insufficient solder, so manufacturers can reduce costs by eliminating board scrap or rework.
“When our SPI is configured with the Auto Repair feature, manufactures enhance first pass yield and reduce operational costs,” said Joel Scutchfield, Koh Young America Sales Director. “The 3D SPI becomes more than an inspection system, it becomes a process optimizer.”
Award-winning Koh Young Process Optimizer (KPO)
Beyond hardware solutions, the company was also recognized for the Koh Young Process Optimizer (KPO). KPO includes a set of software modules that exercise complex algorithms to develop and implement closed-loop print process improvements through machine-to-machine (M2M) connectivity.
“Product miniaturization is driving smaller aperture designs and finer solders, which makes printing a highly-sophisticated process with significant impact on yields. Manufacturers must constantly develop and apply optimal printing parameters during production,” said Ray Welch, Project Manager at Koh Young America. “With so many print process variables, it takes real expertise to correctly define the ideal parameters. Using KPO will help automate the process with continual monitoring and adjustment.”
The Smart Factory Demonstrated
Koh Young has been driving toward the smart factory for years and we showed our resolve in several ways at APEX.
“Not only did Koh Young proudly participate in the IPC Connected Factory Exchange (CFX) and Hermes demo lines, we highlighted numerous ways we can convert our true 3D measurement data into actionable information,” said Brent Fischthal, Sr. Marketing Manager at Koh Young America and an IPC CFX Committee member. “Complementing the CFX and Hermes standards, Koh Young KSMART uses the latest artificial intelligence technology to help manufacturers realize a smart factory.”
Throughout the show, Koh Young presented how its new AI Platform intelligently applies real-time data to improve the production process. Koh Young integrated additional solutions in several of the demo lines at some of our partners, which included ITW EAE, Panasonic Factory Solutions, Fuji America, Cogiscan, and Eunil.
As IPC APEX EXPO concludes, we now turn to NEPCON China, where Koh Young will highlight its latest innovations for the inspection market, including new hardware and software solutions that drive production and process improvements. We welcome show attendees to visit us in the Surface Mount Technology Pavilion at the Shanghai World Expo Center during 24-26 April 2019.
About Koh Young Technology Inc.
Koh Young Technology Inc., the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, China, Mexico, and the United States. These local facilities ensure it sustains a close relationship with its growing customer base, while providing them with access to a global network of inspection and measurement experts.
Suggested Items
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.